20V P-Channel 1.5V Specified PowerTrench® Thin WL-CSP MOSFETGeneral DescriptionDesigned on Fairchild's advanced 1.5 V PowerTrench® process with state of the art "fine pitch" Thin WLCSP packaging process, the FDZ375P minimizes both PCB space and rDS(on). This advanced WLCSP MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, ultra-low profile packaging, low gate charge, and low rDS(on). Product Status/Pricing/Packing
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Features
Applications
ModelsFor additional information please visit the Models page .
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