These devices consist of a gallium arsenide infrared emitting diode optically coupled to a monolithic silicon phototransistor detector, in a surface mountable, small outline, plastic package. They are ideally suited for high density applications and eliminate the need for through-the-board mounting.

• UL recognized (File #E90700, volume 2)
• VDE recognized (File #13616) (add option "V" for VDE approval, i.e., MOC215V-M)
• Conventient Plastic SOIC-8 Surface Mountable Package Style
• Low LED input current required, for easier logic interfacing
• Standard SOIC-8 footprint, with a 0.050" lead spacing
• Compatible with dual wave, vapor phase and IR reflow soldering
• High input - Output isolation of 2500 Vac (rms) guaranteed

• Low power logic circuits
• Interfacing and coupling systems of different potentials and impedances
• Telecommunications equipment
• Portable electronics