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SOIC-8

Contents
Dimensions  | Pb-free reliability test results | Container specifications | Ordering information | Moisture sensitivity | References


Dimensions

Package details
Device dimensions  PDF

Package material disclosure:
SOIC8 PDF (93 K)
Last updated: July 2003

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Pb-free reliability test results

Pb-free reliability test results

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Container specifications

Tape and reel specifications  PDF

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Ordering information

Industry standard series (LM,MC,TL,UC)  PDF
FAN/RC/RM/RV series  PDF
TMC/FMS series  PDF

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Moisture sensitivity

JEDEC Publications (JEP-113-B)*  PDF

  

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References

JEDEC (Standards/Publications)*
Note: requires JEDEC registration; access is free.
IPC (Surface Mount Land Patterns)*
PackageTech (semiconductor assembly manufacturing links)*

*(exiting main Fairchild site)

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Analog and Mixed Signal packaging
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        © 2008 Fairchild Semiconductor    
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spaceLast updated: May 14, 2008