TO-252-3 (DPAK)

Contents Dimensions  | Container specifications | Ordering information | Moisture sensitivity | References

Dimensions Package details Device dimensions  PDF Package material disclosure TO252-3 (DPAK) PDF (92 K) Last updated: September 2003

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Container specifications

Tape and reel specifications  PDF

 

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Ordering information

Industry standard series (LM,MC,TL,UC)  PDF KA series  PDF FAN/RC/RM/RV series  PDF

 

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Moisture sensitivity

JEDEC publications (JEP-113-B)*  PDF

 

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References

JEDEC (Standards/Publications)* Note: requires JEDEC registration; access is free. IPC (Surface Mount Land Patterns)* PackageTech (semiconductor assembly manufacturing links)*

*(exiting main Fairchild site)

 

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