FAIRCHILD MOSFET BGAs combine small footprint, low profile, low R_DS(ON) , and low thermal resistance to effectively address the needs of space-sensitive, performance-oriented load management applications.

Fairchild's family of BGA products, which are today shipping in high-volume production for a variety of applications, offer superior electrical and thermal performance required for advanced portable products. This advanced performance allows the designer the ability to obtain excellent power dissipation and low loss for power management applications without sacrificing valueable board space or adding uneeded cost to the system. The maximum package height of 0.8 mm addresses industry requirements for low-profile packages to allow for thinner product profiles and placement of these devices underneath RF shields, internal sub-assemblies, and displays.

BGA Features & Benefits
BGA Selector Guide
Power BGA
Advanced Packaging