Fairchild SSOT-6 FLMP N & P - Channel MOSFET Packaging Saves PCB
Board Space Without Sacrificing Power Dissipation Capability
Fairchild’s latest family of unique power MOSFETs combines the company’s PowerTrench® technology and advanced SuperSOT™-6 FLMP (Flipchip in a Leaded Molded Package).
Fairchild’s patented FLMP packaging eliminates conventional wire-bonds and also provides an extremely low thermal resistance path between the PCB and the MOSFET die (drain connection). This can greatly improve performance compared to many other MOSFET packages by reducing both the electrical and the thermal constraints. The benefit to the designer is high performance in a package that takes up 70% less board space than an SO-8. An industry trend is towards much smaller eighth and sixteenth brick form factors for telecom and other applications.
These products expand Fairchild’s systems solutions for power supplies, including PWMs, DC/DC converters, LDOs, optocouplers, and voltage references
