Power BGA

MOSFET BGAs combine small footprint, low profile, low R_DS(ON), and low thermal resistance to effectively address the needs of space-sensitive, performance-oriented load management and power conversion applications.

Fairchild's family of BGA products, which are today shipping in high-volume production for a variety of applications, offer superior electrical and thermal performance required for advanced portable products. This advanced performance allows the designer the ability to obtain excellent power dissipation and low loss for power management applications without sacrificing valuable board space or adding unneeded cost to the system. The maximum package height of 0.8 mm to 0.9 mm addresses industry requirements for low-profile packages to allow for thinner product profiles and placement of these devices underneath RF shields internal sub-assemblies.