Package Qual  Reliability Summary

Part Number Type		Die Type		Package
IRF820		17405		TO-252
Test  9037 Cell 1
Stress	Conditions	Results	Sample Size	Duration
IOL(1)	PD=2.0W, delta Tj=100C	0	77	8750	Cyc
HT Drain Bias	Tc=175C, Vds=80% Rated	0	73	1000	Hrs
HT Gate Bias	Tc=175C, Vgs=100% Rated	0	77	1000	Hrs
Temp Cycle(1)	-55C, +150C, Air	0	77	1000	Cyc
Autoclave(1)	Ta=121C, 15psi	0	77	96	Hrs
H3TRB(1)	Ta=85C, RH=85%, Vds=50V	0	77	1000	Hrs
Solder Heat	CDF-AEC-Q101	0	30
Solderability	MIL STD 750	0	10
DPA	CDF-AEC-Q101-004	0	2
Thermal Resistance	JESD-24	0	10
Note 1: Preconditioning per AEC Q101 (J113)

 

Part Number Type		Die Type		Package
IRF820		17405		TO-252
Test  9037 Cell 3
Stress	Conditions	Results	Sample Size	Duration
IOL(1)	PD=2.0W, delta Tj=100C	0	77	8750	Cyc
HT Drain Bias	Tc=175C, Vds=80% Rated	0	77	1000	Hrs
HT Gate Bias	Tc=175C, Vgs=100% Rated	0	77	1000	Hrs
Temp Cycle(1)	-55C, +150C, Air	0	77	1000	Cyc
Autoclave(1)	Ta=121C, 15psi	0	77	96	Hrs
H3TRB(1)	Ta=85C, RH=85%, Vds=50V	0	77	1000	Hrs
Solder Heat	CDF-AEC-Q101	0	30
Solderability	MIL STD 750	0	10
DPA	CDF-AEC-Q101-004	0	2
Thermal Resistance	JESD-24	0	10
Note 1: Preconditioning per AEC Q101 (J113)