Package Qual Reliability Summary

Part Number Type Die Type Package
HGTP20N35G3 49076 TO-220
Test  9048 Cell 1
Stress Conditions
per AEC Q101
Results Sample
Size
Duration
IOL PD=4.0W, delta Tj=100C 0 77 8750 Cyc
HT Drain Bias Tc=175C, Vce=80% Rated 0 77 1000 Hrs
HT Gate Bias Tc=175C, Vge=100% Rated 0 77 1000 Hrs
Temp Cycle -55C, +150C, Air 0 77 1000 Cyc
Autoclave Ta=121C, 15psi 0 77 96 Hrs
H3TRB Ta=85C, RH=85%, Vcd=45V 0 77 1000 Hrs
DPA CDF-AEC-Q101-004 0 2    
Solder Heat CDF-AEC-Q101 0 30    
Solderability MIL STD 750 0 10    
Thermal Resistance JESD-24 0 5    

 

Part Number Type Die Type Package
HGTP20N35G3 49076 TO-220
Test  9048 Cell 2
Stress Conditions
per AEC Q101
Results Sample
Size
Duration
IOL PD=4.0W, delta Tj=100C 0 77 8750 Cyc
HT Drain Bias Tc=175C, Vce=80% Rated 0 77 1000 Hrs
HT Gate Bias Tc=175C, Vge=100% Rated 0 77 1000 Hrs
Temp Cycle -55C, +150C, Air 0 77 1000 Cyc
Autoclave Ta=121C, 15psi 0 77 96 Hrs
H3TRB Ta=85C, RH=85%, Vcd=45V 0 77 1000 Hrs
DPA CDF-AEC-Q101-004 0 2    
Solder Heat CDF-AEC-Q101 0 30    
Solderability MIL STD 750 0 10    
Thermal Resistance JESD-24 0 5    

 

Sumitomo 6600 Epoxy Reliability Summary
Part Number Type Die Type Package
HGTP20N35G3 49076 TO-220
Test  9048 Cell 3
Stress Conditions
per AEC Q101
Results Sample
Size
Duration
IOL(1) PD=4.0W, delta Tj=100C 0 77 8750 Cyc
HT Drain Bias Tc=175C, Vce=80% Rated 0 77 1000 Hrs
HT Gate Bias Tc=175C, Vge=100% Rated 0 77 1000 Hrs
Temp Cycle -55C, +150C, Air 0 77 1000 Cyc
Autoclave Ta=121C, 15psi 0 77 96 Hrs
H3TRB Ta=85C, RH=85%, Vcd=45V 0 77 1000 Hrs
DPA CDF-AEC-Q101-004 0 2    
Solder Heat CDF-AEC-Q101 0 29    
Solderability MIL STD 750 0 10    
Thermal Resistance JESD-24 0 5    
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