Power IGBT Reliability Summary

Part Number Type Die Type Package
HGTN40N60A4D 49349

SOT-227

Test  10096 
Stress Conditions Results Sample
Size
Duration
Thermal Fatigue PD=40W, delta Tj=100C 0 30 8750 Cyc
Drain Bias Tc=150C, Vce=80% Rated 0 30 1000 Hrs
Gate Bias Tc=150C, Vge=100% Rated 0 15 1000 Hrs
Temp Cycle -55C, +150C, Air 0 30 1000 Cyc
Pressure Cooker Ta=121C, 15psi 0 30 96 Hrs
Relative Humidity Ta=85C, RH=85% Vce=40V 0 15 1000 Hrs

 

Part Number Type Die Type Package
HGTN40N60A4D 49349 SOT-227
Test  11030 Cell 1
Stress Conditions Results Sample
Size
Duration
Thermal Fatigue PD=40W, delta Tj=100C 0 40 8750 Cyc
Drain Bias Tc=150C, Vce=80% Rated 0 39 1000 Hrs
Gate Bias Tc=150C, Vge=100% Rated 0 40 1000 Hrs
Temp Cycle -55C, +150C, Air 0 30 1000 Cyc
Pressure Cooker Ta=121C, 15psi 0 30 96 Hrs
Relative Humidity Ta=85C, RH=85% Vce=40V 0 30 1000 Hrs

 

Part Number Type Die Type Package
HGTN40N60A4D 49349 SOT-227
Test  11030 Cell 2
Stress Conditions Results Sample
Size
Duration
Thermal Fatigue PD=40W, delta Tj=100C 0 40 8750 Cyc
Drain Bias Tc=150C, Vce=80% Rated 0 40 1000 Hrs
Gate Bias Tc=150C, Vge=100% Rated 0 40 1000 Hrs
Temp Cycle -55C, +150C, Air 0 30 1000 Cyc
Pressure Cooker Ta=121C, 15psi 0 30 96 Hrs
Relative Humidity Ta=85C, RH=85% Vce=40V 0 30 1000 Hrs
 
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