Power MOSFET Reliability Summary

Part Number Type Die Type Package
HUF75652G3 75652 TO-247
Test 9044 Lot 1
Stress Conditions
per AEC Q101
Results Sample
Size
Duration
Thermal Fatigue PD=7W, delta Tj=100C 0 40 5,000 Cyc
Drain Bias Tc=175C, Vds=80% Rated 0 40 1000 Hrs
Gate Bias Tc=175C, Vgs=100% Rated 0 40 1000 Hrs
Temp Cycle -55C, +150C, Air 0 40 1000 Cyc
Operating LIfe Tc=175C, Vds=15V 0 40 1000 Hrs
Pressure Cooker Ta=121C, 15psi 0 40 96 Hrs
Relative Humidity Ta=85C, RH=85% 0 40 1000 Hrs

 

Part Number Type Die Type Package
HUF75652G3 75652 TO-247
Test 9044 Lot 2
Stress Conditions
per AEC Q101
Results Sample
Size
Duration
Thermal Fatigue PD=7W, delta Tj=100C 0 40 5,000 Cyc
Drain Bias Tc=175C, Vds=80% Rated 0 40 1000 Hrs
Gate Bias Tc=175C, Vgs=100% Rated 0 40 1000 Hrs
Temp Cycle -55C, +150C, Air 0 40 1000 Cyc
Operating LIfe Tc=175C, Vds=15V 0 40 1000 Hrs
Pressure Cooker Ta=121C, 15psi 0 40 96 Hrs
Relative Humidity Ta=85C, RH=85% 0 40 1000 Hrs

 

Part Number Type Die Type Package
HUF75652G3 75652 TO-247
Test 9044 Lot 3
Stress Conditions
per AEC Q101
Results Sample
Size
Duration
Thermal Fatigue PD=7W, delta Tj=100C 0 40 5,000 Cyc
Drain Bias Tc=175C, Vds=80% Rated 0 40 1000 Hrs
Gate Bias Tc=175C, Vgs=100% Rated 0 40 1000 Hrs
Temp Cycle -55C, +150C, Air 0 40 1000 Cyc
Operating LIfe Tc=175C, Vds=15V 0 40 1000 Hrs
Pressure Cooker Ta=121C, 15psi 0 40 96 Hrs
Relative Humidity Ta=85C, RH=85% 0 40 1000 Hrs
 
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