Power MOSFET Reliability Summary

Part Number Type Die Type Package
HUF76145S3 76145 TO-262/3
Test 8011/8019 Lot 1
Stress Conditions Results Sample
Size
Duration
Thermal Fatigue(1) PD=4.0W, delta Tj=100C 0 40 12,000 Cyc
Drain Bias Tc=150C, Vds=80% Rated 0 77 1000 Hrs
Gate Bias Tc=150C, Vgs=100% Rated 0 77 1000 Hrs
Temp Cycle(1) -55C, +150C, Air 0 40 1000 Cyc
Pressure Cooker(1) Ta=121C, 15psi 0 77 96 Hrs
Relative Humidity(1) Ta=85C, RH=85%, Vds=80V 0 77 1000 Hrs
Operating LIfe Tc=175C, Vds=15V 0 40 1000 Hrs
Note 1: Preconditioned

 

Part Number Type Die Type Package
HUF76145S3 76145 TO-262/3
Test 8011/8019 Lot 2
Stress Conditions Results Sample
Size
Duration
Thermal Fatigue(1) PD=4.0W, delta Tj=100C 0 40 12,000 Cyc
Drain Bias Tc=150C, Vds=80% Rated 0 77 1000 Hrs
Gate Bias Tc=150C, Vgs=100% Rated 0 77 1000 Hrs
Temp Cycle(1) -55C, +150C, Air 0 40 1000 Cyc
Pressure Cooker(1) Ta=121C, 15psi 0 77 96 Hrs
Relative Humidity(1) Ta=85C, RH=85%, Vds=80V 0 77 1000 Hrs
Operating LIfe Tc=175C, Vds=15V 0 40 1000 Hrs
Note 1: Preconditioned
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