78307 Ultrafet NCH PWR MOS STD GATE Reliability Qualification Report

Power MOSFET Reliability Summary

Part Number Type		Die Type		Package
HUF75307TS3		78307		SOT-223
Test 9042 Lot 1
Stress	Conditions per AEC Q101	Results	Sample Size	Duration
Thermal Fatigue⁽¹⁾	PD=2.0W, delta Tj=100C	0	77	15000	Cyc
Drain Bias	Tc=150C, Vds=80% Rated	0	77	1000	Hrs
Gate Bias	Tc=150C, Vgs=100% Rated	0	77	1000	Hrs
Temp Cycle⁽¹⁾	-55C, +150C, Air	0	77	1000	Cyc
Pressure Cooker⁽¹⁾	Ta=121C, 15psi	0	77	96	Hrs
Relative Humidity⁽¹⁾	Ta=85C, RH=85%, Vds=45V	0	77	1000	Hrs
Operating LIfe	Tc=150C, Vds=15V	0	40	1000	Hrs
ESD	CDF-AEC-Q101-001	0	10	250VHB 50MM
DPA	CDF-AEC-Q101-004	0	2
Thermal Resistance	JESD-24	0	5
Dielectric Integrity	CDF-AEC-Q101-004	0	5
UIS	CDF-AEC-Q101-004	TBD	5
Note 1: Preconditioning per AEC Q101 (J113)

Data Book Type		Die Type		Package
HUF75307TS3		78307		SOT-223
Test 9045 Lot 1
Stress	Conditions per AEC Q101	Results	Sample Size	Duration
Thermal Fatigue⁽¹⁾	PD=2.0W, delta Tj=100C	0	77	15000	Cyc
Drain Bias	Tc=150C, Vds=80% Rated	0	77	1000	Hrs
Gate Bias	Tc=150C, Vgs=100% Rated	0	77	1000	Hrs
Temp Cycle⁽¹⁾	-55C, +150C, Air	0	77	1000	Cyc
Pressure Cooker⁽¹⁾	Ta=121C, 15psi	0	77	96	Hrs
Relative Humidity⁽¹⁾	Ta=85C, RH=85%, Vds=45V	0	77	1000	Hrs
Operating LIfe	Tc=150C, Vds=15V	0	40	1000	Hrs
Note 1: Preconditioning per AEC Q101 (J113)

Data Book Type		Die Type		Package
HUF75307TS3		78307		SOT-223
Test 9055 Lot 1
Stress	Conditions per AEC Q101	Results	Sample Size	Duration
Thermal Fatigue⁽¹⁾	PD=2.0W, delta Tj=100C	0	77	15000	Cyc
Drain Bias	Tc=150C, Vds=80% Rated	0	77	1000	Hrs
Gate Bias	Tc=150C, Vgs=100% Rated	0	77	1000	Hrs
Temp Cycle⁽¹⁾	-55C, +150C, Air	0	77	1000	Cyc
Pressure Cooker⁽¹⁾	Ta=121C, 15psi	0	77	96	Hrs
Relative Humidity⁽¹⁾	Ta=85C, RH=85%, Vds=45V	0	77	1000	Hrs
Operating LIfe	Tc=150C, Vds=15V	0	77	1000	Hrs
Note 1: Preconditioning per AEC Q101 (J113)