Power MOSFET Reliability Summary

Part Number Type Die Type Package
RFP30P06 09834 TO-220
Test 7070 Lot 1
Stress Conditions
per AEC Q101
Results Sample
Size
Duration
Thermal Fatigue PD=4.75W, delta Tj=125C 0 77 8750 Cyc
Drain Bias Tc=175C, Vds=80% Rated 0 77 1000 Hrs
Gate Bias Tc=175C, Vgs=100% Rated 0 77 1000 Hrs
Temp Cycle -55C, +150C, Air 0 77 1000 Cyc
Pressure Cooker Ta=121C, 15psi 0 77 96 Hrs
Relative Humidity Ta=85C, RH=85%, Vds=80V 0 77 1000 Hrs
ESD CDF-AEC-Q101-001 0 10 1000VHBM 400V MM

 

Part Number Type Die Type Package
RFP30P06 09834 TO-220
Test 7070 Lot 2
Stress Conditions
per AEC Q101
Results Sample
Size
Duration
Thermal Fatigue PD=4.75W, delta Tj=125C 0 77 8750 Cyc
Drain Bias Tc=175C, Vds=80% Rated 0 77 1000 Hrs
Gate Bias Tc=175C, Vgs=100% Rated 0 77 1000 Hrs
Temp Cycle -55C, +150C, Air 0 77 1000 Cyc
Pressure Cooker Ta=121C, 15psi 0 77 96 Hrs
Relative Humidity Ta=85C, RH=85%, Vds=80V 0 77 1000 Hrs

 

Part Number Type Die Type Package
RFP30P06 09834 TO-220
Test 7070 Lot 3
Stress Conditions
per AEC Q101
Results Sample
Size
Duration
Thermal Fatigue PD=4.75W, delta Tj=125C 0 77 8750 Cyc
Drain Bias Tc=175C, Vds=80% Rated 0 77 1000 Hrs
Gate Bias Tc=175C, Vgs=100% Rated 0 77 1000 Hrs
Temp Cycle -55C, +150C, Air 0 77 1000 Cyc
Pressure Cooker Ta=121C, 15psi 0 77 96 Hrs
Relative Humidity Ta=85C, RH=85%, Vds=80V 0 77 1000 Hrs
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