Package Qual Reliability Summary

Part Number Type Die Type Package
RF1S30P06 9834 TO-262
Test  9068 Cell 1
Stress Conditions
per AEC Q101
Results Sample
Size
Duration
IOL(1) PD=4.0W, delta Tj=100C 0 77 10000 Cyc
HT Drain Bias Tc=175C, Vds=80% Rated 0 77 1000 Hrs
HT Gate Bias Tc=175C, Vgs=100% Rated 0 77 1000 Hrs
Temp Cycle(1) -55C, +150C, Air 0 77 1000 Cyc
Autoclave(1) Ta=121C, 15psi 0 40 96 Hrs
H3TRB(1) Ta=85C, RH=85%, Vds=40V 0 77 1000 Hrs
Solder Heat CDF-AEC-Q101 0 30    
Solderability MIL STD 750 0 10    
DPA CDF-AEC-Q101-004 0 2    
Thermal Resistance JESD-24 0 10    
Note 1: Preconditioning per AEC Q101 (J113)

 

Part Number Type Die Type Package
RF1S30P06 9834 TO-262
Test  9068 Cell 2
Stress Conditions
per AEC Q101
Results Sample
Size
Duration
IOL(1) PD=4.0W, delta Tj=100C 0 77 10000 Cyc
HT Drain Bias Tc=175C, Vds=80% Rated 0 77 1000 Hrs
HT Gate Bias Tc=175C, Vgs=100% Rated 0 77 1000 Hrs
Temp Cycle(1) -55C, +150C, Air 0 77 1000 Cyc
Autoclave(1) Ta=121C, 15psi 0 40 96 Hrs
H3TRB(1) Ta=85C, RH=85%, Vds=40V 0 77 1000 Hrs
Solder Heat CDF-AEC-Q101 0 30    
Solderability MIL STD 750 0 10    
DPA CDF-AEC-Q101-004 0 2    
Note 1: Preconditioning per AEC Q101 (J113)
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