Transfer of Products to 6" Facility
In addition to our extensive introduction of products and the recent completion of the world's first 8 inch Power, wafer fab facility, Fairchild Semiconductor, Mountaintop is pursuing its program of continuous improvement with the transition of products currently produced in the 5 inch wafer fab to our 6 inch facility. By September 1998, we will cease production of all 5 inch wafers at the Mountaintop facility.
Since both the 5 inch and the 6 inch fabs in Mountaintop have been qualified and have been running MOS and IGBT products, the transition will be smooth and rapid. The majority of products produced at Mountaintop over the last 9 years , have been produced in a 6 inch wafer fab and it is highly likely that customers are buying products almost identical from our 6 inch wafer fab today.
There will be no layout or design change for any MOS, IGBT, or Surgector products transitioned to the 6" facility. Rectifiers will utilize the more robust Nitride glassivation overcoat used on all MOS and IGBT devices, instead of the present PSG overcoat. In addition, all products will have the additional silver metal layer(20KA) on top of the backside metallization (Al/Ti/Ni) that has proven so successful on our 8" wafers for enhancing solderability of wafer and die sales to both our external and internal customers.
The 6 inch facility is a Class 10 clean room environment, which offers an improvement in quality and defect density over products manufactured in the Class 100, 5 inch, fab clean room environment. Samples are available upon request. However, most customers are currently using parts from the 6' facility, and should not require additional samples.
Qualification data can be found below, and will be posted as it becomes available.
