Plastic Power Package Improvements
Fairchild is making improvements to all Power Semiconductor packages. These improvements were recently introduced with the enhanced version of our UltraFET® Power MOSfet products(See:PCN 9935 ), and are now being extended across the board.
The primary focus was to increase the moisture resistance capability by changing to an superior epoxy encapsulation, which has excellent adhesion to the Top of Die(TOD) surface. At the same time, this new epoxy has lower stress and higher purity levels to meet the durability requirements demanded by the automotive industry over the extreme temperature ranges and harsh operating environments.
With the trend in SMD mounting towards higher peak temperatures and multiple reflows, additional locks and moisture resistance grooves have been added to large mass surface mount(SMD) packages listed below. These prevent separation of the epoxy from the leads and silicon during the thermal shock of board mount.
An extensive reliability qualification was conducted on over 3700 devices with these changes. A world class failure rate of only 0.02 FITS at 55OC was demonstrated by the data at: UltraFET® Qualification Matrix
The following packages will be improved as described above:
- TO-220
- TO-220 Alt
- TO-262
- TO-263
- TO-251
- TO-252
- TO-247
- TO-218
Additional information and reliability data concerning these improvements can be found at:
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