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POWER DEVICE RELIABILITY SUMMARY
| DEVICE POWER MOS | PACKAGE HEX-DIP | |||
| PROCESS LOW VOLTAGE PCH PWR MOS | ||||
| APPLIED STRESS | FAILURES | SAMPLE | CUM. TIME | |
| THERMAL FATIGUE Pd=1 w, Delta=70 deg c. |
0 | 200 | 2400000 | CYS |
| OPERATING LIFE 15 volts, T=200 deg c. |
0 | 100 | 50000 | HRS |
| HIGH TEMP REV BIAS 80% Rated voltage, 150 deg c. |
0 | 120 | 60000 | HRS |
| HIGH TEMP GATE BIAS 100% Rated voltage, 150 deg c. |
0 | 80 | 40000 | HRS |
| STORAGE LIFE T=200 deg c. |
0 | 120 | 60000 | HRS |
| THERMAL SHOCK -65 to 250 deg c. Liq/Liq. |
0 | 120 | 72000 | CYS |
| AUTOCLAVE T=121 deg c, 15 psig |
0 | 100 | 9600 | HRS |
| FAILURE RATE @ 55 Deg. C, 60% Confidence, 1.0 EV Activation: 5.469934 FIT |
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