UltraFET® Qualification Plan
Intersil is adding additional value to it's UltraFET® Power MOSFET products. They have all been enhanced to meet the durability requirements demanded by the automotive industry over the extreme temperature ranges and harsh operating environments.
These enhancements have been achieved through minor changes in the
- Spacing of the field rings at the edge of the device.
- Planarization of this area for low temperature capability.
- Isolation for high energy fields.
While these minor changes improve the durability in extreme operating conditions, they result in no change in electrical performance or parametric distribution.
Additional improvements have been made in the TO-262/TO-263, TO-220 Alternate, and TO-251/TO-252 SMD packages for all UltraFET® products. The trend in SMD mounting is towards higher peak soldering temperatures, and one or more additional reflows with dual-sided boards or rework.
In order to meet these conditions without separation of the epoxy from the leads and silicon, additional locks and moisture barriers have been added to these power packages. At the same time, a new epoxy has been selected with lower stress and higher purity levels.
These changes have been initially implemented only on our UltraFET® line of products at this time. They will be phased into all power products in the next 6-9 months. You will receive a separate notice when that change will become effective.
The plan and Qualification data can be found at UltraFET® Qual Data
