Motion-SPM™ in µMini-DIP Series Optimizes Wide Range of Inverter Driver Applications
Integrating one HVICs, one LVIC, six IGBTs, six FRDs, three bootstrap diodes and NTC thermistor that are fully tested into a compact 39mm x 23mm μMini-DIP package, Motion-SPM™ modules replace up to 23 discrete components. These products are instrumental in reducing board space, decreasing manufacturing costs and speeding time-to-market and increasing system reliability.
µMini-DIP packaged modules integrate three bootstrap diodes with bootstrap resistor characteristics to eliminate an additional six external components and NTC thermistor (1% tolerance) to case temperature monitoring. μMini-DIP packaged modules also feature advanced NPT IGBTs that provide optimal trade-offs between conduction and switching losses, short dead time and high guaranteed junction temperature, (TJ=150°C) to improve system efficiency and reliability.