Smart Power Module (SPM®)
Motion-SPM™ in μMini-DIP
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Overview

Motion-SPM™ in µMini-DIP Series Optimizes Wide Range of Inverter Driver Applications

Integrating one HVICs, one LVIC, six IGBTs, six FRDs, three bootstrap diodes and NTC thermistor that are fully tested into a compact 39mm x 23mm μMini-DIP package, Motion-SPM™ modules replace up to 23 discrete components. These products are instrumental in reducing board space, decreasing manufacturing costs and speeding time-to-market and increasing system reliability.

µMini-DIP packaged modules integrate three bootstrap diodes with bootstrap resistor characteristics to eliminate an additional six external components and NTC thermistor (1% tolerance) to case temperature monitoring. μMini-DIP packaged modules also feature advanced NPT IGBTs that provide optimal trade-offs between conduction and switching losses, short dead time and high guaranteed junction temperature, (TJ=150°C) to improve system efficiency and reliability.

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Features

  • Built-in advanced NPT IGBTs provide optimal conduction loss and switching Loss.
  • Short dead time
  • The package optimized for thermal performance, high power density and compactness for low-power inverter-driven applications
  • High guaranteed junction temperature range
  • Improved ruggedness due to adopted advanced NPT IGBT
  • Isolation voltage of 2000Vrms
  • UVLO and SC protection function
  • OT protection function using built-in NTC thermistor (Optional)
  • 3 divided negative DC-link terminals for inverter current sensing applications
  • Easy PCB layout due to built-in bootstrap diode & independent VS pin
  • Single-grounded power supply due to built-in HVIC
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Application Notes

  • AN-9070: Smart Power Module Motion-SPM™ Products in µMini DIP SPM® Packages, PDF
  • AN-9071: Smart Power Module Motion-SPM™ in µMini DIP SPM® Thermal Performance Information, PDF
  • AN-9072: Smart Power Module Motion-SPM™ in µMini DIP SPM® Mounting Guidance, PDF
  • AN-9021: A Novel IGBT Inverter Module for Low-Power Drive Applications, PDF
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