Overview

The Motion-SPM™ in Mini-DIP series consists of a suite of seventeen IGBT inverter modules and two MOSFET modules offering excellent thermal resistance. Each module integrate three high voltage ICs (HVICs), one low voltage IC (LVIC) and six IGBTs with fast recovery diodes or MOSFETs in the compact Mini-DIP (44 mm X 26.8 mm) package. Designers can achieve increased design flexibility for the entire power range from 0.15kW to 3kW, as these devices range from 3A to 30 A in a single package outline. This Motion-SPM™ series could be reached to the targeted power rating of 30A in ultra-compact packaging through Fairchild’s Direct Bonded Copper (DBC) technology (FSBB series).

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Features

• 600V/3A to 30A rating in one package (with identical mechanical layouts)
  
• Low-loss efficient IGBTs and FRDs optimized for motor drive applications
  
• 3-phase IGBT inverter bridge including control ICs for gate driving and protection
       - High-side: Control circuit under voltage (UV) protection (without fault signal output)
       - Low-side: UV and short-circuit (SC) protection through external shunt resistor (with fault signal output)
  
• Single-grounded power supply and opto-coupler-less interface due to built-in HVIC
  
• High-active input signal logic
• Divided negative DC-link terminals for inverter current sensing applications
  
• Isolation voltage rating of 2500Vrms/min
  
• Very low leakage current due to ceramic and DBC substrate.
  
• Package designed to satisfy the basic creepage and clearance spacing – UL certified No. E209204

Application Notes

• AN-9035: Smart Power Module Motion-SPM™ in Mini-DIP User's Guide, PDF
• AN-9044: Smart Power Module Motion-SPM in Mini DIP SPM Ver.4 User's Guide, PDF
• AN-9019: Motor Drive System Using SPM® Inverter, PDF
• AN-9021: A Novel IGBT Inverter Module for Low-Power Drive Applications, PDF