Overview

The Motion-SPM™ in Tiny-DIP combines six FRFETs and three half-bridge HVICs in a compact, thermally efficient, 29 x 12 mm DIP package. The FRFETs, featuring fast and soft recovery body diodes, offer a combination of lower switching losses, lower conduction losses at low current, and a wider reverse bias safe operating area (RBSOA) when compared to IGBTs. The body diodes are used as freewheeling diodes, eliminating the need for additional components. This Motion-SPM™ series is designed to enhance energy efficiency, lower electromagnetic interference, increase reliability and save PCB board space in low power brushless dc (BLDC) motor applications.

• Application Circuit Example
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Features

• 500V, 0.5A, 1A, 1.2A and 250V 1A rating, 3 - phase MOSFET inverter bridge including control ICs for gate driving
  
• High reliability due to fully tested coordination of HVIC and MOSFETs
  
• Single-grounded power supply and opto-coupler-less interface due to built-in HVIC
  
• High-active input signal logic resolves the startup and shutdown sequence constraint between the control supply and control input providing fail-safe operation with direct connection between the SPM® and a 3.3V CPU or DSP. Additional external sequence logic is not needed
  
• 3 divided negative DC-link terminals for inverter current sensing applications
  
• Typical switching frequency of 15kHz
  
• Isolation voltage rating of 1500Vrms/min.

Application Notes

• AN-9042: Smart Power Module Tiny-DIP-SPM User’s Guide, PDF
• AN-9021: A Novel IGBT Inverter Module for Low-Power Drive Applications, PDF