As DC-DC applications, such as power modules, telecommunications and servers, become more space-constrained, designers are looking for smaller devices to meet their design challenges. Fairchild Semiconductor developed the Dual Cool™ packaging for MOSFETs to meet the needs for better thermal characteristics, high current capability, high efficiency, and smaller form factors.
The Dual Cool package is a top-side cooling PQFN device that incorporates new packaging technology which enables additional power dissipation through the top of the package resulting in more than 60 percent higher power dissipation capability than standard PQFN packaging when a heat sink is mounted.
Key Features of Fairchild's Dual Cool™ Packaging
- More than 60% better power dissipation
- Highest power density for DC-DC applications
- Lower operating temperature increases reliability
- Available in Power33 (3.3mm x 3.3mm) and Power56 (5mm x 6mm) packaging options
Key Benefits
- Highest power density for DC-DC applications
- Use with or without a heatsink, reducing the number of qualified components in the AVL
- Multiple suppliers without cross licensing requirements
- Industry-standard PQFN footprint allows power engineers to rapidly qualify MOSFETs in Dual Cool packaging
Applications
- DC-DC synchronous buck conversion
- Desktop, Notebook, and Server
- Telecommunications, routing, and switching
Design Resources, Samples Request, & White Paper
