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Interface & Logic Ordering Information

Contents
Logic Products | USB Products | LVDS | Fairchild Switch | Fairchild Switch Analog | TinyLogic® | ABT Family | AS & ALS Family | 74C Family | CD4K Family | CGS Family | F100K 300 Series ECL Family | FACT™ & FACT Quiet Series™ | FAST® & FASTr™ Family | GTL Family | HCMOS Family | LCX Family | LVQ Family | LVT Family | CROSSVOLT™ LVX Family | VCX™ Family | SCAN Family | VHC Family | FXL Family | ALVC Family | Advanced ECL
 

Logic Products

X X X X X 2 4 5 M E A X    
                        Special Variations
  X: Tape & Reel
  " ": Rail/Tube
  Package Code
  BQ = DQFN (-14, -16, -20)
  GF = mBGA
  K8: 8-Lead USB
  L6 = 6-Terminal MicroPak™
  L8 = 8-Terminal MicroPak™
  L10 = 10-Terminal MicroPak™
  M/SC: (0.150" Wide) Molded Small Outline Package, JEDEC (SOIC)
  M5: 5-Lead SOT23-5
  MSA: Shrink Small Outline Package EIAJ Type (SSOP)
  MEA: Shrink Small Outline Package JEDEC (48/50-Lead SSOP)
  MTC: Thin Shrink Small Outline Package JEDEC 4.4mm Body Width (TSSOP)
  MTD: Thin Shrink Small Outline Package JEDEC, 6.1mm body Width (48/56-Lead TSSOP)
  P5: 5-Lead SC70
  P6: 6-Lead SC70
  WM: (0.300" Wide) Molded Small Outline Package JEDEC (SOIC)
  Device Type
  Feature Designation
  U = Unbuffered
  Family Designator/Series
  74ABT: ABT
  74AC: Fairchild AC
  74ACT: FACT™ (Fairchild Advanced CMOS Technology),  TTL Compatible
  74ACT: Fairchild AC, TTL Compatible
  74F: F Series
  74LCX: LCX
  74LVQ: LVQ
  74LVT: LVT
  74 LVX: LVX
  74VCX: VCX
  74VHC: Very High Speed CMOS (VHC)
  CD4: CD4K
  CGS3: CMOS Crystal Clock Generators
  DM74ALS: Advanced Low Voltage Schottky
  DM74AS: Advanced Schottky
  FXL, FXLP: Level Translators
  NC7: TinyLogic
  SSTV: Series Stub Terminator Logic
  MM74C: C-Series
  MM74HC: HC
  SCAN: SCAN

 

GTLP/USB Products

X X X 9 T 3 0 6 M T C X    
                        Special Variations
  X: Tape & Reel
  " ": Rail/Tube
  Package Code
  M: Molded Small Outline Package (SOP)
  MEA: Shrink Small Outline Package (SSOP)
  MTC: Thin Shrink Small Outline Package (TSSOP)
  MTD: Thin Shrink Small Outline Package (TSSOP)
  Device Type
  8: Bit Width
    Data bit width of device
    (e.g., 6, 8, 16, 18)
  T: Function
    T: Transceiver
    B: Bidirectional (driver & receiver)
    C: Clock Driver
  Technology
  USB: Universal Serial Bus

 

LVDS

F I N 1 X X X X X X    
                Package Reference
  M5(X): 5-Lead SOT23, JEDEC
  K8(X): 8-Lead USB, JEDEC
  M(X): Molded Small-Outline Package (SOIC), JEDEC
  MSA9X): Shrink Small-Outline Package (SSOP), EIAJ Type II
  MTC(X): Thin Shrink Small-Outline Package (TSSOP), JEDEC
  MTD(X): 48/56 Lead Thin Shrink Small-Outline Package (TSSOP), JEDEC
  VB(X): Thin QuadFlatPak (TQFP), JEDEC
  Device Function
  Example: 051
  Aligns with Industry Function Names
  Fairchild Technology Family
  1: Low Voltage Differential Signalling (LVDS)
Fairchild Interface

 

Fairchild Switch (Digital)

F S T X X X X M X    
                  Special Variations
  X: Tape & Reel
  " ": Rail/Tube
  Package Code
  G: Fine-Pitch Ball Grid Array (FBGA)
  M: (0.150" Wide) Molded Small Outline Package, JEDEC (SOIC)
  WM: (0.300" Wide) Molded Small Outline Package JEDEC (SOIC)
  MEA: Shrink Small Outline Package JEDEC (48/56-Lead SSOP)
  MTC: Thin Shrink Small Outline Package JEDEC, 4.4mm Body Width (TSSOP)
  MTD: Thin Shrink Small Outline Package JEDEC 6.1mm Body Width (48/56-Lead TSSOP)
  QSC: Quarter Size Outline Package JEDEC (QSOP)
  M5: SOT23 5-Lead
  P5: SC70 5-Lead
  P6: SC70 6-Lead
  K8: USB 8-Lead
  BQ = DQFN
  L6 = 6-Terminal MicroPak™
  L8 = 8-Terminal MicroPak™
  Device Type
  Feature Designation
  D: Diode
  U: Undershoot Protection
  Family
  FST: Fairchild Switch
  NC7xx: TinyLogic (for xx see above)
  SB: Single Switch
  SZ: Single Gate Ultra-High-Speed CMOS
  WB: Dual Switch

 

Fairchild Analog and Application Specific Switches

F S 1 X X X X X X    
              Package Reference
  K8(X): USB
  L6(X): MicroPak™ 6-Lead
  L8(X): MicroPak™ 8-Lead
  L10 = 10-Terminal MicroPak™
  MPX MLP: Molded Leadless Package
  M(X): (0.150" Wide) Molded Small Outline Package JEDEC (SOIC)
  M5(X): SOT23 5 Lead
  MTC(X): Thin Shrink Small Outline Package JEDEC, 4.4mm Body Width (TSSOP)
  QSC(X): Quarter Size Outline Package JEDEC (QSOP)
  P5(X): SC70 5-Lead
  P6(X): SC70 6-Lead
  BQ(X): DQFN (MLP)
  Device Function
  Technology Feature
  AL: LAN Switch
  AV: Video Switch
  U: Undershoot Protection
  USB = USB switch
  HDMI = HDMI Differential Switch
Fairchild Switch Analog

 

TinyLogic®

N C 7 X X X X X X X X    
                      Special Variations
  X: Tape & Reel in Quantities of 3000 and 5000
  " ": Tape & Reel in Quantities of 250
  Package Code
  M5: 5-Lead SOT23-5
  P5: 5-Lead SC70
  P6: 6-Lead SC70
  L6: 6-Terminal MicroPak™
  L8: 8-Terminal MicroPak™
  L10 = 10-Terminal MicroPak™
  K8: 8-Lead USB
  Device Type
  Feature Designation
  U: Unbuffered
  Series
  Q: S: Single Bit High Speed CMOS
  SP: Single Bit Ultra Low Power CMOS
  SV: Single Bit Ultra Low Power-A CMOS
  ST: Single Bit High Speed CMOS (TTL Compatible Inputs)
  SZ: Single Bit Ultra High Speed CMOS
  NP: Triple Bit Ultra Low Power CMOS
  NV: Triple Bit Ultra Low Power-A CMOS
  NZ: Triple Bit Ultra High Speed CMOS
  WP: Dual Bit Ultra Low Power CMOS
  WV: Dual Bit Ultra Low Power-A CMOS
  WZ: Dual Bit Ultra High Speed CMOS
Family

 

ABT Family

7 4 A B T X X X S C X    
                      Special Variations
  X: Tape & Reel
  " ": Rail/Tube
  Package Code
  PC: Plastic Dual In-Line Package (DIP)
  SC: Molded Small Outline Package, JEDEC (SOIC)
  SJ: Molded small Outline Package, EIAJ (SOIC)
  SSC: Shrink Small Outline Package (48/56-Lead SSOP)
  MSA: Shrink Small Outline Package, EIAJ, Type II (SSOP)
  MTC: thin Shrink Small Outline Package, JEDEC, 4.4mm Body Width (TSSOP)
  MTD: Thin Shrink Small Outline Package, JEDEC, 6.1mm Body Width (48/56-Lead TSSOP)
  Device Type
  Operating Temperature Range Family
  74: -40°C to +85°C

 

AS & ALS Family

D M 7 4 A L S X X X N X    
                        Special Variations
  X: Tape & Reel
  " ": Rail/Tube
  Package Code
  N: Molded Dual In-Line Package (DIP)
  M: (0.150" Wide) Molded Small Outline Package, JEDEC (SOIC)
  WM: (0.300" Wide) Molded Small Outline Package, JEDEC (SOIC)
  SJ: Molded Small Outline Package, EIAJ (SOIC)
  MSA: Shrink Small Outline Package, EIAJ, Type II (SSOP)
  Device Type
  Family
  ALS: Advanced Low Power Schottky
  AS: Advanced Schottky
  Operating Temperature Range Family
  74: 0°C to +70°C

 

74C Family

M M 7 4 C X X X N X    
                    Special Variations
  X: Tape & Reel
  " ": Rail/Tube
  Package Code
  N: Molded Dual In-Line Package (DIP)
  M = (0.150" Wide) Molded Small Outline Package, JEDEC (SOIC)
  WM: (0.300" Wide) Molded Small Outline Package, JEEC (SOIC)
  Device Type
  Operating Temperature Range Family
  74: -40°C to +85°C

 

CD4K Family

C D 4 X X X B C N X    
                    Special Variations
  X: Tape & Reel
  " ": Rail/Tube
  Package Code
  N: Molded Dual In-Line Package (DIP)
  M = (0.150" Wide) Molded Small Outline Package, JEDEC (SOIC)
  WM: (0.300" Wide) Molded Small Outline Package, JEDEC (SOIC)
  SJ: Molded Small Outline Package, EIAJ (SOIC)
  MCT: Thin Shrink Small Outline Package, JEDEC, 4.4mm body Width (TSSOP)
  Operating Temperature Range Family
  74: -40°C to +85°C
  Series
  " ": A Series
  B: B Series, "Buffered"
  UB: Unbuffered
  Device Type
Family

 

CGS Family

C G S 3 3 X X M X    
                  Special Variations
  X: Tape & Reel
  " ": Rail/Tube
  Package Code
  M: (0.150" Wide) Molded Small Outline Package, JEDEC (SOIC)
  Device Type
Family

 

F100K 300 Series ECL Family

1 0 0 3 X X D C X    
                  Special Variations
  X: Tape & Reel
  " ": Rail/Tube
  Package Code
  PC: Plastic Dual In-Line Package (DIP) (0°C to +85°C)
  SC: Molded Small Outline Package, JEDEC (SOIC) (0°C to +85°C)
  QC: Plastic Chip Carrier Package (PCC) (0°C to +85°C)
  QJ: Plastic Leaded Chip Carrier Package (PCC) (-40°C to +85°C)
Device Type

 

FACT™ & FACT Quiet Series™

7 4 A C / A C T X X X P C X    
                            Special Variations
  X: Tape & Reel
  " ": Rail/Tube
  Package Code
  PC: Plastic Dual In-Line Package (DIP)
  SPC: (0.300" Wide) Plastic Dual In-Line Package (DIP)
  SC: Molded Small Outline Package JEDEC (SOIC)
  SJ: Molded Small Outline Package, EIAJ (SOIC)
  SSC: Shrink Small Outline Package (48/56-Lead SSOP)
  MSA: Shrink Small Outline Package, EIAJ, Type II (SSOP)
  MTC: Thin Shrink Small Outline Package, JEDEC, 4.4mm Body Width (TSSOP)
  MTD: Thin Shrink Small Outline Package, JEDEC, 6.1mm Body Width (48/56-Lead TSSOP)
  QC: Plastic Leaded Chip Carrier (PLCC)
  QSC: Quarter Size Outline Package (QSOP)
  Device Type
  Family
  AC: FACT™
  ACT: TTL-Compatible FACT™
  ACQ: FACT Quiet Series™
  ACTQ: FACT Quiet Series™ TTL-Compatible
  Operating Temperature Range Family
  74: -40°C to +85°C

 

FAST® & FASTr™ Family

7 4 F X X X S C X    
                  Special Variations
  X: Tape & Reel
  " ": Rail/Tube
  Package Code
  PC: Plastic Dual In-Line Package (DIP)
  SPC: (0.300" Wide) Plastic Dual In-Line Package (DIP)
  SC: Molded Small Outline Package, JEDEC (SOIC)
  SJ: Molded Small Outline Package, EIAJ (SOIC)
  SSC: Shrink Small Outline Package (48/56-Lead SSOP)
  MSA: Shrink Small Outline Package, EIAJ, Type II (SSOP)
  QC: Plastic Chip Carrier Package (PCC) (0°C to +85°C)
  Device Type
  Family
  F: FAST®
  FR: FASTr™
  Operating Temperature Range
  X: 74: 0°C to +70°C

 

GTL Family

G T L P X X X X X M E A X    
                          Special Variations
  X: Tape & Reel
  " ": Rail/Tube
  Package Code
  MEA: Shrink Small Outline Package, JEDEC (48/56-Lead SSOP)
  MTD: Thin Shrink Small Outline Package, JEDEC, 6.1mm Body Width (48/56-Lead TSSOP)
  Device Type
Family

 

HCMOS Family

M M 7 4 W C X X X N X    
                      Special Variations
  X: Tape & Reel
  " ": Rail/Tube
  Package Code
  N: Molded Dual In-Line Package (DIP)
  M: (0.150" Wide) Molded Small Outline Package, JEDEC (SOIC)
  WM: (0.300" Wide) Molded Small Outline Package, JEDEC (SOIC)
  SJ: Molded Small Outline Package, EIAJ (SOIC)
  MCT: thin Shrink Small Outline Package, JEDEC, 4.4mm Body Width (TSSOP)
  Device Type
  Family
  HC: CMOS Input Levels
  HCT: TTL-Compatible Input Levels
  Operating Temperature Range Family
  74: -40°C to +85°C

 

LCX Family

7 4 L C X X X X M X    
                    Special Variations
  X: Tape & Reel
  " ": Rail/Tube
  Package Code
  M = (0.150" Wide) Molded Small Outline Package, JEDEC (SOIC)
  WM: (0.300" Wide) Molded Small Outline Package, JEDEC (SOIC)
  SJ: Molded Small Outline Package, EIAJ (SOIC)
  MEA: Shrink Small Outline Package, JEDEC, (48/56-Lead SSOP)
  MSA: Shrink Small Outline Package, EIAJ, Type II (SSOP)
  MTC: Thin Shrink Small Outline Package, JEDEC, 4.4mm body Width (TSSOP)
  MTD: Thin Shrink Small Outline Package, JEDEC, 6.1mm body Width (48-56-Lead TSSOP)
  BQX: DQFN
  Device Type
  Family
  Operating Temperature Range Family
  74: -40°C to +85°C

 

LVQ Family

7 4 L V Q X X X S C X    
                      Special Variations
  X: Tape & Reel
  " ": Rail/Tube
  Package Code
  SC: Molded Small Outline Package, JEDEC (SOIC)
  SJ: Molded Small Outline Package, EIAJ (SOIC)
  QSC: Quarter Size Outline Package (QSOP)
  Device Type
  Family
  Operating Temperature Range Family
  74: -40°C to +85°C

 

LVT Family

7 4 L V T X X X M X    
                    Special Variations
  X: Tape & Reel
  " ": Rail/Tube
  Package Code
  WM: (0.300" Wide) Molded Small Outline Package, JEDEC (SOIC)
  SJ: Molded Small Outline Package, EIAJ (SOIC)
  MEA: Shrink Small Outline Package, JEDEC, (48/56-Lead SSOP)
  MSA: Shrink Small Outline Package, EIAJ, Type II (SSOP)
  MTC: Thin Shrink Small Outline Package, JEDEC, 4.4mm body Width (TSSOP)
  MTD: Thin Shrink Small Outline Package, JEDEC, 6.1mm body Width (48-56-Lead TSSOP)
  Device Type
  Family
  Operating Temperature Range Family
  74: -40°C to +85°C

 

LVX Family

7 4 L V X X X X M X    
                    Special Variations
  X: Tape & Reel
  " ": Rail/Tube
  Package Code
  M: (0.150" Wide) Molded Small Outline Package, JEDEC (SOIC)
  WM: (0.300" Wide) Molded Small Outline Package, JEDEC (SOIC)
  SJ: Molded Small Outline Package, EIAJ (SOIC)
  MEA: Shrink Small Outline Package, JEDEC, (48/56-Lead SSOP)
  MTC: Thin Shrink Small Outline Package, JEDEC, 4.4mm body Width (TSSOP)
  MTD: Thin Shrink Small Outline Package, JEDEC, 6.1mm body Width (48-56-Lead TSSOP)
  QSC: Small Outline Package, JEDEC (QSOP)
  BQX: DQFN
  G(x): Fine Pitch Ball Grid Array
  Device Type
  Family
  Operating Temperature Range Family
  74: -40°C to +85°C

 

VCX™ Family

7 4 V C X X X X M X    
                    Special Variations
  X: Tape & Reel
  " ": Rail/Tube
  Package Code
  MTD: Thin Shrink Small Outline Package, JEDEC, 6.1mm body Width (48-56-Lead TSSOP)
  G(x): Fine Pitch Ball Grid Array
  M: (0.150" Wide) Molded Small Outline Package, JEDEC (SOIC)
  WM: (0.300" Wide) Molded Small Outline Package, JEDEC (SOIC)
  MTC: Thin Shrink Small Outline Package, JEDEC, 4.4mm body Width (TSSOP)
  BQ = DQFN
  Device Type
  Family
  Operating Temperature Range Family
  74: -40°C to +85°C

 

SCAN Family

S C A N 1 8 2 4 5 T S S C X    
                            Special Variations
  X: Tape & Reel
  " ": Rail/Tube
  Package Code
  SC: Molded Small Outline Package, JEDEC (SOIC)
  SSC; Shrink Small Outline Package (48/56-Lead SSOP)
  Technology/Designator
  T: TTL Input/TTL Output CMOS Device
  A: BiCMOS Device
  F: TTL Input/CMOS Output CMOS Device
  Device Type
  18-Bit Test Access Logic
Serially Controlled Access Network

 

VHC Family

7 4 V H C X X X M X    
                    Special Variations
  X: Tape & Reel
  " ": Rail/Tube
  Package Code
  N: Molded Dual In-Line Package (DIP)
  M: (0.150" Wide) Molded Small Outline Package, JEDEC (SOIC)
  WM: (0.300" Wide) Molded Small Outline Package, JEDEC (SOIC)
  SJ: Molded Small Outline Package, EIAJ (SOIC)
  MEA: Shrink Small Outline Package, JEDEC (48/56-Lead SSOP)
  MTC: Thin Shrink Small Outline Package, JEDEC, 4.4mm body Width (TSSOP)
  MTD: Thin Shrink Small Outline Package, JEDEC, 6.1mm body Width (48-56-Lead TSSOP)
  Device Type
  Family
  VHC: CMOS Input Levels
  VHCT: TTL-Compatible Input Levels
  Operating Temperature Range Family
  74: -40°C to +85°C

 

FXL Family Translators

F X L X X X X X X    
                Special Variations Designator
  X: Tape & Reel
  " ": Rail/Tube
  Package Designator
  BQ = DQFN
  GF = mBGA
  L6: 6-Terminal MicroPak™
  L10 = 10-Terminal MicroPak™
  P5: 5-Lead SC70
  Device Type
Translator

 

ALVC Family

7 4 A L V C X X X M X    
                      Special Variations
  X: Tape & Reel
  " ": Rail/Tube
  Package Code
  MTD: Thin Shrink Small Outline Package, JEDEC, 6.1mm Body Width (48/56-Lead TSSOP)
  Device Type
  Family
  Operating Temperature Range Family
  74: -40°C to +85°C

 

Advanced ECL

1 0 0 X X X X X X X M X    
                        Special Variations
  X: Tape & Reel
  " ": Rail/Tube
  Package Code
  M: SOIC
Device Type
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