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Logic Products
| X |
X |
X |
X |
X |
2 |
4 |
5 |
M |
E |
A |
X |
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Special Variations
X: Tape & Reel
" ": Rail/Tube |
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Package Code
BQ = DQFN (-14, -16, -20)
GF = mBGA
K8: 8-Lead USB
L6 = 6-Terminal MicroPak™
L8 = 8-Terminal MicroPak™
L10 = 10-Terminal MicroPak™
M/SC: (0.150" Wide) Molded Small Outline Package, JEDEC (SOIC)
M5: 5-Lead SOT23-5
MSA: Shrink Small Outline Package EIAJ Type (SSOP)
MEA: Shrink Small Outline Package JEDEC (48/50-Lead SSOP)
MTC: Thin Shrink Small Outline Package JEDEC 4.4mm Body Width (TSSOP)
MTD: Thin Shrink Small Outline Package JEDEC, 6.1mm body Width (48/56-Lead TSSOP)
P5: 5-Lead SC70
P6: 6-Lead SC70
WM: (0.300" Wide) Molded Small Outline Package JEDEC
(SOIC) |
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Device Type |
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Feature Designation
U = Unbuffered |
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Family Designator/Series
74ABT: ABT
74AC: Fairchild AC
74ACT: FACT™ (Fairchild Advanced CMOS Technology),
TTL Compatible
74ACT: Fairchild AC, TTL Compatible
74F: F Series
74LCX: LCX
74LVQ: LVQ
74LVT: LVT
74 LVX: LVX
74VCX: VCX
74VHC: Very High Speed CMOS (VHC)
CD4: CD4K
CGS3: CMOS Crystal Clock Generators
DM74ALS: Advanced Low Voltage Schottky
DM74AS: Advanced Schottky
FXL, FXLP: Level Translators
NC7: TinyLogic
SSTV: Series Stub Terminator Logic
MM74C: C-Series
MM74HC: HC
SCAN: SCAN |
GTLP/USB Products
| X |
X |
X |
9 |
T |
3 |
0 |
6 |
M |
T |
C |
X |
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Special Variations
X: Tape & Reel
" ": Rail/Tube |
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Package Code
M: Molded Small Outline Package (SOP)
MEA: Shrink Small Outline Package (SSOP)
MTC: Thin Shrink Small Outline Package (TSSOP)
MTD: Thin Shrink Small Outline Package (TSSOP) |
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Device Type
8: Bit Width
Data bit width of device
(e.g., 6, 8, 16, 18)
T: Function
T: Transceiver
B: Bidirectional (driver & receiver)
C: Clock Driver |
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Technology
USB: Universal Serial Bus |
LVDS
| F |
I |
N |
1 |
X |
X |
X |
X |
X |
X |
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Package Reference
M5(X): 5-Lead SOT23, JEDEC
K8(X): 8-Lead USB, JEDEC
M(X): Molded Small-Outline Package (SOIC), JEDEC
MSA9X): Shrink Small-Outline Package (SSOP), EIAJ Type II
MTC(X): Thin Shrink Small-Outline Package (TSSOP), JEDEC
MTD(X): 48/56 Lead Thin Shrink Small-Outline Package (TSSOP), JEDEC
VB(X): Thin QuadFlatPak (TQFP), JEDEC |
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Device Function
Example: 051
Aligns with Industry Function Names |
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Fairchild Technology Family
1: Low Voltage Differential Signalling (LVDS) |
| Fairchild Interface |
Fairchild Switch (Digital)
| F |
S |
T |
X |
X |
X |
X |
M |
X |
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Special Variations
X: Tape & Reel
" ": Rail/Tube |
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Package Code
G: Fine-Pitch Ball Grid Array (FBGA)
M: (0.150" Wide) Molded Small Outline Package, JEDEC (SOIC)
WM: (0.300" Wide) Molded Small Outline Package JEDEC (SOIC)
MEA: Shrink Small Outline Package JEDEC (48/56-Lead SSOP)
MTC: Thin Shrink Small Outline Package JEDEC, 4.4mm Body Width (TSSOP)
MTD: Thin Shrink Small Outline Package JEDEC 6.1mm Body Width (48/56-Lead TSSOP)
QSC: Quarter Size Outline Package JEDEC (QSOP)
M5: SOT23 5-Lead
P5: SC70 5-Lead
P6: SC70 6-Lead
K8: USB 8-Lead
BQ = DQFN
L6 = 6-Terminal MicroPak™
L8 = 8-Terminal MicroPak™ |
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Device Type |
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Feature Designation
D: Diode
U: Undershoot Protection |
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Family
FST: Fairchild Switch
NC7xx: TinyLogic (for xx see above)
SB: Single Switch
SZ: Single Gate Ultra-High-Speed CMOS
WB: Dual Switch |
Fairchild Analog and Application Specific Switches
| F |
S |
1 |
X |
X |
X |
X |
X |
X |
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Package Reference
K8(X): USB
L6(X): MicroPak™ 6-Lead
L8(X): MicroPak™ 8-Lead
L10 = 10-Terminal MicroPak™
MPX MLP: Molded Leadless Package
M(X): (0.150" Wide) Molded Small Outline Package
JEDEC (SOIC)
M5(X): SOT23 5 Lead
MTC(X): Thin Shrink Small Outline Package JEDEC,
4.4mm Body Width (TSSOP)
QSC(X): Quarter Size Outline Package JEDEC (QSOP)
P5(X): SC70 5-Lead
P6(X): SC70 6-Lead
BQ(X): DQFN (MLP) |
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Device Function |
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Technology Feature
AL: LAN Switch
AV: Video Switch
U: Undershoot Protection
USB = USB switch
HDMI = HDMI Differential Switch |
| Fairchild
Switch Analog |
TinyLogic®
| N |
C |
7 |
X |
X |
X |
X |
X |
X |
X |
X |
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Special Variations
X: Tape & Reel in Quantities of 3000 and 5000
" ": Tape & Reel in Quantities of 250 |
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Package Code
M5: 5-Lead SOT23-5
P5: 5-Lead SC70
P6: 6-Lead SC70
L6: 6-Terminal MicroPak™
L8: 8-Terminal MicroPak™
L10 = 10-Terminal MicroPak™
K8: 8-Lead USB |
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Device Type |
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Feature Designation
U: Unbuffered |
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Series
Q: S: Single Bit High Speed CMOS
SP: Single Bit Ultra Low Power CMOS
SV: Single Bit Ultra Low Power-A CMOS
ST: Single Bit High Speed CMOS (TTL Compatible Inputs)
SZ: Single Bit Ultra High Speed CMOS
NP: Triple Bit Ultra Low Power CMOS
NV: Triple Bit Ultra Low Power-A CMOS
NZ: Triple Bit Ultra High Speed CMOS
WP: Dual Bit Ultra Low Power CMOS
WV: Dual Bit Ultra Low Power-A CMOS
WZ: Dual Bit Ultra High Speed CMOS |
| Family |
ABT Family
| 7 |
4 |
A |
B |
T |
X |
X |
X |
S |
C |
X |
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Special Variations
X: Tape & Reel
" ": Rail/Tube |
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Package Code
PC: Plastic Dual In-Line Package (DIP)
SC: Molded Small Outline Package, JEDEC (SOIC)
SJ: Molded small Outline Package, EIAJ (SOIC)
SSC: Shrink Small Outline Package (48/56-Lead SSOP)
MSA: Shrink Small Outline Package, EIAJ, Type II (SSOP)
MTC: thin Shrink Small Outline Package, JEDEC, 4.4mm Body Width (TSSOP)
MTD: Thin Shrink Small Outline Package, JEDEC, 6.1mm Body Width (48/56-Lead TSSOP) |
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Device Type |
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Operating Temperature Range Family
74: -40°C to +85°C |
AS & ALS Family
| D |
M |
7 |
4 |
A |
L |
S |
X |
X |
X |
N |
X |
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Special Variations
X: Tape & Reel
" ": Rail/Tube |
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Package Code
N: Molded Dual In-Line Package (DIP)
M: (0.150" Wide) Molded Small Outline Package, JEDEC (SOIC)
WM: (0.300" Wide) Molded Small Outline Package, JEDEC (SOIC)
SJ: Molded Small Outline Package, EIAJ (SOIC)
MSA: Shrink Small Outline Package, EIAJ, Type II (SSOP) |
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Device Type |
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Family
ALS: Advanced Low Power Schottky
AS: Advanced Schottky |
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Operating Temperature Range Family
74: 0°C to +70°C |
74C Family
| M |
M |
7 |
4 |
C |
X |
X |
X |
N |
X |
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Special Variations
X: Tape & Reel
" ": Rail/Tube |
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Package Code
N: Molded Dual In-Line Package (DIP)
M = (0.150" Wide) Molded Small Outline Package, JEDEC (SOIC)
WM: (0.300" Wide) Molded Small Outline Package, JEEC (SOIC) |
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Device Type |
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Operating Temperature Range Family
74: -40°C to +85°C |
CD4K Family
| C |
D |
4 |
X |
X |
X |
B |
C |
N |
X |
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Special Variations
X: Tape & Reel
" ": Rail/Tube |
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Package Code
N: Molded Dual In-Line Package (DIP)
M = (0.150" Wide) Molded Small Outline Package, JEDEC (SOIC)
WM: (0.300" Wide) Molded Small Outline Package, JEDEC (SOIC)
SJ: Molded Small Outline Package, EIAJ (SOIC)
MCT: Thin Shrink Small Outline Package, JEDEC, 4.4mm body Width (TSSOP) |
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Operating Temperature Range Family
74: -40°C to +85°C |
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Series
" ": A Series
B: B Series, "Buffered"
UB: Unbuffered |
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Device Type |
| Family |
CGS Family
| C |
G |
S |
3 |
3 |
X |
X |
M |
X |
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Special Variations
X: Tape & Reel
" ": Rail/Tube |
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Package Code
M: (0.150" Wide) Molded Small Outline Package, JEDEC (SOIC) |
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Device Type |
| Family |
F100K 300 Series ECL Family
| 1 |
0 |
0 |
3 |
X |
X |
D |
C |
X |
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Special Variations
X: Tape & Reel
" ": Rail/Tube |
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Package Code
PC: Plastic Dual In-Line Package (DIP) (0°C to +85°C)
SC: Molded Small Outline Package, JEDEC (SOIC) (0°C to +85°C)
QC: Plastic Chip Carrier Package (PCC) (0°C to +85°C)
QJ: Plastic Leaded Chip Carrier Package (PCC) (-40°C to +85°C) |
| Device Type |
FACT™ & FACT Quiet Series™
| 7 |
4 |
A |
C |
/ |
A |
C |
T |
X |
X |
X |
P |
C |
X |
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Special Variations
X: Tape & Reel
" ": Rail/Tube |
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Package Code
PC: Plastic Dual In-Line Package (DIP)
SPC: (0.300" Wide) Plastic Dual In-Line Package (DIP)
SC: Molded Small Outline Package JEDEC (SOIC)
SJ: Molded Small Outline Package, EIAJ (SOIC)
SSC: Shrink Small Outline Package (48/56-Lead SSOP)
MSA: Shrink Small Outline Package, EIAJ, Type II (SSOP)
MTC: Thin Shrink Small Outline Package, JEDEC, 4.4mm Body Width (TSSOP)
MTD: Thin Shrink Small Outline Package, JEDEC, 6.1mm Body Width (48/56-Lead TSSOP)
QC: Plastic Leaded Chip Carrier (PLCC)
QSC: Quarter Size Outline Package (QSOP) |
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Device Type |
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Family
AC: FACT™
ACT: TTL-Compatible FACT™
ACQ: FACT Quiet Series™
ACTQ: FACT Quiet Series™ TTL-Compatible |
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Operating Temperature Range Family
74: -40°C to +85°C |
FAST® & FASTr™ Family
| 7 |
4 |
F |
X |
X |
X |
S |
C |
X |
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Special Variations
X: Tape & Reel
" ": Rail/Tube |
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Package Code
PC: Plastic Dual In-Line Package (DIP)
SPC: (0.300" Wide) Plastic Dual In-Line Package (DIP)
SC: Molded Small Outline Package, JEDEC (SOIC)
SJ: Molded Small Outline Package, EIAJ (SOIC)
SSC: Shrink Small Outline Package (48/56-Lead SSOP)
MSA: Shrink Small Outline Package, EIAJ, Type II (SSOP)
QC: Plastic Chip Carrier Package (PCC) (0°C to +85°C) |
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Device Type |
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Family
F: FAST®
FR: FASTr™ |
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Operating Temperature Range
X: 74: 0°C to +70°C |
GTL Family
| G |
T |
L |
P |
X |
X |
X |
X |
X |
M |
E |
A |
X |
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Special Variations
X: Tape & Reel
" ": Rail/Tube |
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Package Code
MEA: Shrink Small Outline Package, JEDEC (48/56-Lead SSOP)
MTD: Thin Shrink Small Outline Package, JEDEC, 6.1mm Body Width (48/56-Lead TSSOP) |
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Device Type |
| Family |
HCMOS Family
| M |
M |
7 |
4 |
W |
C |
X |
X |
X |
N |
X |
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Special Variations
X: Tape & Reel
" ": Rail/Tube |
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Package Code
N: Molded Dual In-Line Package (DIP)
M: (0.150" Wide) Molded Small Outline Package, JEDEC (SOIC)
WM: (0.300" Wide) Molded Small Outline Package, JEDEC (SOIC)
SJ: Molded Small Outline Package, EIAJ (SOIC)
MCT: thin Shrink Small Outline Package, JEDEC, 4.4mm Body Width (TSSOP) |
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Device Type |
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Family
HC: CMOS Input Levels
HCT: TTL-Compatible Input Levels |
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Operating Temperature Range Family
74: -40°C to +85°C |
LCX Family
| 7 |
4 |
L |
C |
X |
X |
X |
X |
M |
X |
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Special Variations
X: Tape & Reel
" ": Rail/Tube |
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Package Code
M = (0.150" Wide) Molded Small Outline Package, JEDEC (SOIC)
WM: (0.300" Wide) Molded Small Outline Package, JEDEC (SOIC)
SJ: Molded Small Outline Package, EIAJ (SOIC)
MEA: Shrink Small Outline Package, JEDEC, (48/56-Lead SSOP)
MSA: Shrink Small Outline Package, EIAJ, Type II (SSOP)
MTC: Thin Shrink Small Outline Package, JEDEC, 4.4mm body Width (TSSOP)
MTD: Thin Shrink Small Outline Package, JEDEC, 6.1mm body Width (48-56-Lead TSSOP)
BQX: DQFN |
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Device Type |
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Family |
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Operating Temperature Range Family
74: -40°C to +85°C |
LVQ Family
| 7 |
4 |
L |
V |
Q |
X |
X |
X |
S |
C |
X |
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Special Variations
X: Tape & Reel
" ": Rail/Tube |
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Package Code
SC: Molded Small Outline Package, JEDEC (SOIC)
SJ: Molded Small Outline Package, EIAJ (SOIC)
QSC: Quarter Size Outline Package (QSOP) |
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Device Type |
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Family |
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Operating Temperature Range Family
74: -40°C to +85°C |
LVT Family
| 7 |
4 |
L |
V |
T |
X |
X |
X |
M |
X |
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Special Variations
X: Tape & Reel
" ": Rail/Tube |
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Package Code
WM: (0.300" Wide) Molded Small Outline Package, JEDEC (SOIC)
SJ: Molded Small Outline Package, EIAJ (SOIC)
MEA: Shrink Small Outline Package, JEDEC, (48/56-Lead SSOP)
MSA: Shrink Small Outline Package, EIAJ, Type II (SSOP)
MTC: Thin Shrink Small Outline Package, JEDEC, 4.4mm body Width (TSSOP)
MTD: Thin Shrink Small Outline Package, JEDEC, 6.1mm body Width (48-56-Lead TSSOP) |
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Device Type |
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Family |
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Operating Temperature Range Family
74: -40°C to +85°C |
LVX Family
| 7 |
4 |
L |
V |
X |
X |
X |
X |
M |
X |
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Special Variations
X: Tape & Reel
" ": Rail/Tube |
| |
Package Code
M: (0.150" Wide) Molded Small Outline Package, JEDEC (SOIC)
WM: (0.300" Wide) Molded Small Outline Package, JEDEC (SOIC)
SJ: Molded Small Outline Package, EIAJ (SOIC)
MEA: Shrink Small Outline Package, JEDEC, (48/56-Lead SSOP)
MTC: Thin Shrink Small Outline Package, JEDEC, 4.4mm body Width (TSSOP)
MTD: Thin Shrink Small Outline Package, JEDEC, 6.1mm body Width (48-56-Lead TSSOP)
QSC: Small Outline Package, JEDEC (QSOP)
BQX: DQFN
G(x): Fine Pitch Ball Grid Array |
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Device Type |
| |
Family |
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Operating Temperature Range Family
74: -40°C to +85°C |
VCX™ Family
| 7 |
4 |
V |
C |
X |
X |
X |
X |
M |
X |
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Special Variations
X: Tape & Reel
" ": Rail/Tube |
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Package Code
MTD: Thin Shrink Small Outline Package, JEDEC, 6.1mm body Width (48-56-Lead TSSOP)
G(x): Fine Pitch Ball Grid Array
M: (0.150" Wide) Molded Small Outline Package, JEDEC (SOIC)
WM: (0.300" Wide) Molded Small Outline Package, JEDEC (SOIC)
MTC: Thin Shrink Small Outline Package, JEDEC, 4.4mm
body Width (TSSOP)
BQ = DQFN |
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Device Type |
| |
Family |
| |
Operating Temperature Range Family
74: -40°C to +85°C |
SCAN Family
| S |
C |
A |
N |
1 |
8 |
2 |
4 |
5 |
T |
S |
S |
C |
X |
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Special Variations
X: Tape & Reel
" ": Rail/Tube |
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Package Code
SC: Molded Small Outline Package, JEDEC (SOIC)
SSC; Shrink Small Outline Package (48/56-Lead SSOP) |
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Technology/Designator
T: TTL Input/TTL Output CMOS Device
A: BiCMOS Device
F: TTL Input/CMOS Output CMOS Device |
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Device Type |
| |
18-Bit Test Access Logic |
| Serially Controlled Access Network |
VHC Family
| 7 |
4 |
V |
H |
C |
X |
X |
X |
M |
X |
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Special Variations
X: Tape & Reel
" ": Rail/Tube |
| |
Package Code
N: Molded Dual In-Line Package (DIP)
M: (0.150" Wide) Molded Small Outline Package, JEDEC (SOIC)
WM: (0.300" Wide) Molded Small Outline Package, JEDEC (SOIC)
SJ: Molded Small Outline Package, EIAJ (SOIC)
MEA: Shrink Small Outline Package, JEDEC (48/56-Lead SSOP)
MTC: Thin Shrink Small Outline Package, JEDEC, 4.4mm body Width (TSSOP)
MTD: Thin Shrink Small Outline Package, JEDEC, 6.1mm
body Width (48-56-Lead TSSOP) |
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Device Type |
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Family
VHC: CMOS Input Levels
VHCT: TTL-Compatible Input Levels |
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Operating Temperature Range Family
74: -40°C to +85°C |
FXL Family Translators
| F |
X |
L |
X |
X |
X |
X |
X |
X |
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Special Variations Designator
X: Tape & Reel
" ": Rail/Tube |
| |
Package Designator
BQ = DQFN
GF = mBGA
L6: 6-Terminal MicroPak™
L10 = 10-Terminal MicroPak™
P5: 5-Lead SC70 |
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Device Type |
| Translator |
ALVC Family
| 7 |
4 |
A |
L |
V |
C |
X |
X |
X |
M |
X |
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Special Variations
X: Tape & Reel
" ": Rail/Tube |
| |
Package Code
MTD: Thin Shrink Small Outline Package, JEDEC, 6.1mm Body Width (48/56-Lead TSSOP) |
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Device Type |
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Family |
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Operating Temperature Range Family
74: -40°C to +85°C |
Advanced ECL
| 1 |
0 |
0 |
X |
X |
X |
X |
X |
X |
X |
M |
X |
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Special Variations
X: Tape & Reel
" ": Rail/Tube |
| |
Package Code
M: SOIC |
| Device Type |
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