Product highlight Fairchild Semiconductor Expands Industry-Leading BGA Package Portfolio in MOSFETs.

Advantages Fairchild Ball Grid Array (BGA) parts provide:

1. Area savings on PC board:
• 66 % Savings for 36 to 48 Bit Logic over Dual TSSOP 56 Lead Packages.
• 67 % Savings for 32 to 40 Bit Logic over Dual TSSOP 48 Lead Packages.
• 65.5 % Savings for 18 to 24 Bit Logic over TSSOP 56 Lead Packages.
• 61 % Savings for 16 to 20 Bit Logic over TSSOP 48 Lead Packages.
2. Large 0.8mm pitch / 0.5mm ball Diameter:
• Easy Routing for access to all balls.
• 0.5mm Balls- increases the standoff from PCB and contributes to solder joint compliance.
3. Bismaleimide Triazine Resin (BT) Substrate:
• Facilitates package reliability die to PCB and Package Coefficient of Thermal Expansion (CTE) matching.
4. Broad Portfolio:
• 16,18,32,36,40 bit CROSSVOLT™ Low Voltage logic (LCX, LVT, VCX™ families)
• 22,24,40,48 bit bus switches (Fairchild Switch)