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Products by Family VCX™ IBIS Models SPICE Models Application Notes Packaging Information Quality and Reliability Request Samples
Products by Family VCX™ IBIS Models SPICE Models Application Notes Packaging Information Quality and Reliability Request Samples
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Advantages Fairchild Ball Grid Array (BGA) parts provide:
- Area savings on PC board:
- 66 % Savings for 36 to 48 Bit Logic over Dual TSSOP 56 Lead Packages.
- 67 % Savings for 32 to 40 Bit Logic over Dual TSSOP 48 Lead Packages.
- 65.5 % Savings for 18 to 24 Bit Logic over TSSOP 56 Lead Packages.
- 61 % Savings for 16 to 20 Bit Logic over TSSOP 48 Lead Packages.
- Large 0.8mm pitch / 0.5mm ball Diameter:
- Easy Routing for access to all balls.
- 0.5mm Balls- increases the standoff from PCB and contributes to solder joint compliance.
- Bismaleimide Triazine Resin (BT) Substrate:
- Facilitates package reliability die to PCB and Package Coefficient of Thermal Expansion (CTE) matching.
- Broad Portfolio:
- 16,18,32,36,40 bit CROSSVOLT™ Low Voltage logic (LCX, LVT, VCX™ families)
- 22,24,40,48 bit bus switches (Fairchild Switch)
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