DQFN and MLP Packaging For Low Voltage Logic

Contents Relative size comparison chart | Logic portfolio in DQFN and MLP | DQFN Latest Click on package below to get more detailed information on the 14, 16, and 20 terminal DQFN packages View logic portfolio in DQFN and MLP

DQFN - Latest

Fairchild now offers VCX^TM and LCX quad, hex and octal logic functions in DQFN packaging. Transceivers, buffers, gates, and de-multiplexers are available now. Significant size reduction from leaded packages makes these ideal for use in cell phones and other ultra-portables. Principle features include:

• DQFN is 75% SMALLER than TSSOP-14, -16, -20.
• Visible solder joints facilitate inspection.
• Low operating voltages and small size make these ideal for full featured cell phones and other ultra-portables.
• Low parasitic capacitance and inductance compared to leaded packages limits noise and crosstalk between terminals.
• Exposed die paddle underneath, allows chips to run cooler than in leaded packages.
• Alternate logic sources in DQFN.