MicroPak™ Packaging

Product listing
• All MicroPak products
  

MicroPak advantages:
• MicroPak provides a 65% space savings over SC70.
• MicroPak 8 terminal provides a 60% space savings compared to US8.
• Superior second level join integrity.
  MicroPak solder join testing has passed 1750 temperature cycles with zero failures. Tested per IPC-9701.
• Compared to FlipChip
  Provides larger area contacts and higher solder dimension (4.7mil nominal) that contributes to reliability.
• Manufacturing friendly dimensions
  1.45mm x 1.0mm x 0.55mm outline is similar to that of chip passives. (1.6mm X 1.6mm for MicroPak 8 terminal)
  Pad pitch of 0.5mm is within the capability of high volume consumer product manufacturing lines.
• All logic performance
  provides - HS, UHS, ULP, ULP-A over 70 logic and switch functions

The MicroPak option for TinyLogic™ packaging

MicroPak evolved from existing chip carrier packaging, having in common a chip mounted on substrate and connections at the package periphery. Fairchild is offering a reduced-size version of these packages while keeping a package pitch of 0.5mm and an overall form-factor close to that of familiar passive chip components.

MicroPak offers the size advantages of chip scale packaging while allowing the benefits of standard SMT assembly, and the reliability of large area terminals. The separate chip-on-substrate approach allows for chip size reduction in support of ongoing competitive pricing. Located at the package periphery, six large 0.2mm x 0.3mm contacts allow for inspection of the solder joint on the land pattern. An industry standard 5mil thick solder stencil provides high reliability solder connections that have been proven in temperature cycling over the full TinyLogic temperature range. A thermally conductive substrate and via design provide low theta J-A, enabling power dissipation capability superior to that of leaded single gate devices.

The same TinyLogic performance available in SOT23 and SC70 packaging is available in MicroPak, which accommodates all of the 5, 6, and 8-lead portfolio - Ultra High Speed (UHS - LCX or LVC -like), as well as HS / HST (HC/HCT-like), and the new 1.0V to 3.6V Ultra Low Power - ULP and ULP-A families. Functions available in MicroPak include standard and configurable gates, flip-flops, dual and triple buffers and inverters, analog switches and multiplexers, and application-specific logic functions for wireless and portable computing products.