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Micropak™ Inspectable Solder Joints

MicroPak showing inspectable solder joints

  • Solder joint height of 4.7 mils (nominal) contributes to joint reliability.
  • Location of pads allows easy inspection of the joint to confirm process capability.

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MicroPak packaging
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Manufacturing guidelines
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TinyLogic™ products

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        © 2008 Fairchild Semiconductor    
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spaceLast updated: February 07, 2008