Interface and Logic Packaging 114 Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
Contents |
DimensionsBody Size: Container Specifications: |
Moisture sensitivityThis test identifies the level of sensitivity of plastic devices to moisture induced stress in order to avoid mechanical damage during handling. |
| Level | Conditions | Floor life |
| 3 | less than 30 C° / 90 % RH | Unlimited |
| Note: JEDEC Spec JESD22-A112-A MOISTURE-INDUCED STRESS SENSITIVITY CLASSIFICATION
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