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Interface and Logic Packaging 8-Lead US8 JEDEC MO-187 Variation CA 3.1mm Wide.

Dimensions

Body Size:
Wide (nom.) = 2.3mm
Long (nom.) = 2.0mm

Board Area:
6.8 sq mm

Package Details:
Device dimensions PDF

Container Quantities:
Tape and Reel = 3000
Container Specifications:
Tube and reel specifications PDF

Package Suffix
K8X

Package Weight
0.00956 grams

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Note: JEDEC Spec JESD22-A112-A
MOISTURE-INDUCED STRESS SENSITIVITY CLASSIFICATION
  1. If a device passes level 1, it is classified as not moisture sensitive and does not require dry pack
  2. If a device fails level 1, but passes a higher level, it is classified as moisture sensitive and must be dry packed. Labeling.should be in accordance with JEP113

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Interface and Logic packaging
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Logic products
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Package codes by product family
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Packaging by lead count
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Thermal data for Interface and Logic packaging
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Top Mark package marking conventions

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        © 2008 Fairchild Semiconductor    
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Space Last updated: April 21, 2008