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Interface and Logic Packaging 80-Lead, QVSOP, JEDEC MO-154, 0.150" Wide
Contents |
Dimensions Body Size:Wide (nom.) = 3.9mm Long (nom.) = 20.5mm Board Area: 147.5 sq. mm Package Details: Device dimensions PDF Package Material Disclosure: QVSOP-80 PDF (105KB) Last Updated: July 2004 Container Quantities: Rail = 460 Tape and Reel = 1500 Package Suffix QSP, QSPX |
| Moisture sensitivity
This test identifies the level of sensitivity of plastic devices to moisture induced stress in order to avoid mechanical damage during handling. |
| Level | Conditions | Floor life |
| 1 | less than 30 C° / 90 % RH | Unlimited |
| Note: JEDEC Spec JESD22-A112-A MOISTURE-INDUCED STRESS SENSITIVITY CLASSIFICATION
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