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Interface and Logic Packaging 8-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MS-153, 4.4mm Wide.
Contents |
Dimensions Body Size:Wide (nom.) = 4.4mm Long (nom.) = 3.0mm Board Area: 23.9 sq mm Package Details: Device dimensions PDF Container Quantities: Tube/Rail = 100 Tape and Reel = 2500 Container Specifications: Tube and reel specifications PDF Package Suffix MTC, MTCX Package Weight 0.0391 grams |
| Moisture sensitivity
This test identifies the level of sensitivity of plastic devices to moisture induced stress in order to avoid mechanical damage during handling. |
| Level | Conditions | Floor life |
| 1 | less than 30 C° / 90 % RH | Unlimited |
| Note: JEDEC Spec JESD22-A112-A MOISTURE-INDUCED STRESS SENSITIVITY CLASSIFICATION
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