Interface and Logic Packaging - 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide

Contents
Dimensions | Moisture sensitivity

Dimensions

Body Size:
Wide (nom.) = 7.5mm
Long (nom.) = 12.8mm

Board Area:
138.4 sq. mm

Package Details:
Device dimensions PDF
Last update: Jan 1999

Package material disclosure:
SOIC20 PDF (93 K)
Last update: July 2003

Pb-free reliability test results
Pb-free reliability test results

Container Quantities:
Tube/Rail = 1080
Tape and Reel = 2000

Container Specifications:
Tube and reel specifications PDF

Package Suffix:
WM, WMX, M, MX, SC, SCX

Package Weight:
0.524 grams

Moisture sensitivity

This test identifies the level of sensitivity of plastic devices to moisture induced stress in order to avoid mechanical damage during handling.

Level	Conditions	Floor life
1	less than 30 C?????? / 90 % RH	Unlimited

Note: JEDEC Spec JESD22-A112-A
MOISTURE-INDUCED STRESS SENSITIVITY CLASSIFICATION

If a device passes level 1, it is classified as not moisture sensitive and does not require dry pack
If a device fails level 1, but passes a higher level, it is classified as moisture sensitive and must be dry packed. Labeling.should be in accordance with JEP113

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