Return to Home
DATASHEETS, SAMPLES, BUY
TECHNICAL INFORMATION
APPLICATIONS
DESIGN CENTER
SUPPORT
COMPANY
INVESTORS
MY FAIRCHILD
 
Japanese Korean Simplified Chinese
  Home >> Technical information >> Packaging information >> Interface and Logic >> 
space

Interface and Logic Packaging - 28-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide

Contents
Dimensions | Moisture sensitivity


Dimensions

Body Size:
Wide (nom.) = 5.27mm
Long (nom.) = 10.2mm

Board Area:
78.54 sq. mm

Package Details:
Device dimensions PDF
Last update: Jan 1999

Container Quantities:
Tube/Rail = 47
Tape and Reel = 2000

Container Specifications:
Tube and reel specifications PDF

Package Suffix:
MSA, MSAX

Package Weight:
0.22 grams

space








space

Moisture sensitivity

This test identifies the level of sensitivity of plastic devices to moisture induced stress in order to avoid mechanical damage during handling.


LevelConditionsFloor life
1less than 30 C� / 90 % RH
Unlimited

Note: JEDEC Spec JESD22-A112-A
MOISTURE-INDUCED STRESS SENSITIVITY CLASSIFICATION
  1. If a device passes level 1, it is classified as not moisture sensitive and does not require dry pack
  2. If a device fails level 1, but passes a higher level, it is classified as moisture sensitive and must be dry packed. Labeling.should be in accordance with JEP113

space

Adobe Acrobat readerMany files on our website are provided in PDF format and require the Adobe Acrobat Reader application in order to view or print them. Acrobat Reader is free and can be downloaded from Adobe's website.
spacespacespace
Related links

Interface and Logic packaging
Dotted line
Logic products
Dotted line
Interface products
Dotted line
Package codes by product family
Dotted line
Packaging by lead count
Dotted line
Thermal data for Interface and Logic packaging
Dotted line
Top Mark package marking conventions

space
space space
        © 2008 Fairchild Semiconductor    
space space
space Last updated: June 13, 2008