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Interface and Logic Packaging - 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
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Dimensions Body Size:Wide (nom.) = 4.4mm Long (nom.) = 5.0mm Board Area: 39.4 sq. mm Package Details: Device dimensions PDF Last update: Jan 2005 Package material disclosure: TSSOP14 PDF(92 k) Last updated: July 2003 Container Quantities: Tube/Rail = 2350 Tape and Reel = 2500 Container Specifications: Tube and reel specifications PDF Package Suffix: MTC, MTCX Package Weight: 0.0533 grams |
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