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Interface and Logic Packaging - 56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide

Contents
Dimensions | Moisture sensitivity


Dimensions

Body Size:
Wide (nom.) = 6.10mm
Long (nom.) = 14.0mm

Board Area:
156.4 sq. mm

Package Details:
Device dimensions PDF
Last update: Jan 1999

Package material disclosure:
TSSOP56 PDF (92 k)
Last update: July 2003

Container Quantities:
Tube/Rail = 28
Tape and Reel = 1000

Container Specifications:
Tube and reel specifications PDF

Package Suffix:
MTD, MTDX, MTX, T, TX

Package Weight:
0.198 grams

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Moisture sensitivity

This test identifies the level of sensitivity of plastic devices to moisture induced stress in order to avoid mechanical damage during handling.


LevelConditionsFloor life
2less than 30 C / 90 % RH
Unlimited

Note: JEDEC Spec JESD22-A112-A
MOISTURE-INDUCED STRESS SENSITIVITY CLASSIFICATION
  1. If a device passes level 1, it is classified as not moisture sensitive and does not require dry pack
  2. If a device fails level 1, but passes a higher level, it is classified as moisture sensitive and must be dry packed. Labeling.should be in accordance with JEP113

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