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Interface and Logic Packaging 20-Lead Plastic Lead Chip Carrier (PLCC), JEDEC MO-047, 0.350" Wide.

Contents
Dimensions | Moisture sensitivity

Dimensions

Body Size:
Wide (nom.) = 8.89mm
Long (nom.) = 8.89mm

Board Area:
98.2 sq mm

Package Details:
Device dimensions PDF

Container Quantities:
Tube/Rail = 40
Tape and Reel = 1000
Container Specifications:
Tube and reel specifications PDF

Package Suffix
QC, QCX

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Moisture sensitivity

This test identifies the level of sensitivity of plastic devices to moisture induced stress in order to avoid mechanical damage during handling.


Level ConditionsFloor life
1 less than 30 C° / 90 % RH
Unlimited

Note: JEDEC Spec JESD22-A112-A
MOISTURE-INDUCED STRESS SENSITIVITY CLASSIFICATION
  1. If a device passes level 1, it is classified as not moisture sensitive and does not require dry pack
  2. If a device fails level 1, but passes a higher level, it is classified as moisture sensitive and must be dry packed. Labeling.should be in accordance with JEP113

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Interface and Logic packaging
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Logic products
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Interface products
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Package codes by product family
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Packaging by lead count
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Thermal data for Interface and Logic packaging
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Top Mark package marking conventions

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        © 2008 Fairchild Semiconductor    
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Space Last updated: August 13, 2008