Overview

As DC-DC applications, such as power modules, telecommunications and servers, become more space-constrained, designers are looking for smaller devices to meet their design challenges. Fairchild Semiconductor developed the Dual Cool™ packaging for MOSFETs to meet the needs for better thermal characteristics, high current capability, high efficiency, and smaller form factors.

The Dual Cool package is a top-side cooling PQFN device that incorporates new packaging technology which enables additional power dissipation through the top of the package resulting in more than 60 percent higher power dissipation capability than standard PQFN packaging when a heat sink is mounted.

Key Features Include:

Design Tools

Fairchild offers Dual Cool™ Packaging evaluation and demo boards. Please contact your local Fairchild represntative or Sales Office.