Dual Cool™ Packaging
 
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Overview


As DC-DC applications, such as power modules, telecommunications and servers, become more space-constrained, designers are looking for smaller devices to meet their design challenges. Fairchild Semiconductor developed the Dual Cool™ packaging for MOSFETs to meet the needs for better thermal characteristics, high current capability, high efficiency, and smaller form factors.

The Dual Cool package is a top-side cooling PQFN device that incorporates new packaging technology which enables additional power dissipation through the top of the package resulting in more than 60 percent higher power dissipation capability than standard PQFN packaging when a heat sink is mounted.

Key Features Include:

More than 60% better power dissipation
Highest power density for DC-DC applications
Lower operating temperature increases reliability
Available in Power33 (3.3mm x 3.3mm) and Power56 (5mm x 6mm) packaging options
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Benefits

Highest power density for DC-DC applications
Use with or without a heatsink, reducing the number of qualified components in the AVL
Multiple suppliers without cross licensing requirements
Industry-standard PQFN footprint allows power engineers to rapidly qualify MOSFETs in Dual Cool packaging
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Applications

DC-DC synchronous buck conversion
Desktop, Notebook, and Server
Telecommunications, routing, and switching
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Design Tools

Fairchild offers Dual Cool™ Packaging evaluation and demo boards. Please contact your local Fairchild represntative or Sales Office.

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