Fairchild Semiconductor Optoelectronics Reliability

New product qualification
All new products evolve through an orderly design-to-manufacture flow. At each state reliability engineering is present to ensure that the defined reliability requirements are met.

The reliability plan is implemented in the development stage where actual testing begins. Stress tests are performed to show potential problem areas and the reliability of the new product is compared directly with that of a previously qualified product of a similar generic type.

During limited production, where components must meet defined reliability goals, samples from a minimum of three lots are taken for extensive testing. These samples must meet or exceed defined goals in order for the product to be considered qualified and transferred to the reliability monitoring program.

Quality Control
Quality controls is a vital function at Fairchild Semiconductor. To minimize variations in the product and to maintain quality and hence reliability, the following in-process control activities are routinely performed:

• Incoming inspection of all piece parts and raw materials

• Die-attach process control gate

• Wire-bond control gate

• Encapsulation control gate

• 100% final testing

• Equipment monitors

• Final QA gate of all lots

• Finished goods stores monitor

• Frequent process line audits for conformance to specification

Monitor Program
To ensure that qualified products continue to meet reliability targets, a monitor program tests generic device families on a periodic basis and provides information for the reliability test bank.

Reliability monitoring consists of the following tests*:

• High Temperature Operating Life
T_A = 70°C or higher temperature
Time = 1000 hours minimum
I_F = max. rated

• High Temperature Storage
T_A = 150°C (black pkg), 125°C (white pkg)
Time = 1000 hours minimum

• Low Temperature Storage
T_A = -55°C or specified
Time = 1000 hours minimum

• 85/85 No Bias and Bias
T_A = 85°C
RH = 85%

• HTRB
T_A = 100°C or specified
Voltage = 80% max. rated
Time = 1000 hours minimum
JEDEC, Method A108A

• Temperature Cycle per MIL-STD-883E, Method 1010.7
T_A = -40°C to +125°C (white pkg), -55°C to +125°C (black pkg)
Number of cycles = 200 (white pkg), 100 (black pkg)

• Solder Heat Tests
JEDEC, Method B106-B
T_A = 260°C ± 5°C
Duration = 10 sec.

• Room Temperature Operating Life (for light emitting diodes only)
T_A = 25°C
I_F = 60mA or max. rated
Time = 1000 hours

• High Humidity, High Temperature Reverse Bias
T_A = 85°C
Humidity = 85%RH
Time = 1000 hours
JEDEC, Method A101-B

• High Temperature Forward Bias
T_A = 70°C
I_F = 20mA
Time = 1000 hours
JEDEC, Method A108-A

• Autoclave
T_A = 121°C
Pressure = 15psi
Humidity = 100%
Time = 96 hours

• IR Reflow
Peak temperature
= 225°C JEDEC (J-STD-020)
= 245°C CECC 00082
Number of cycles = 3

• Solderability Test
T_A = 245°C
Preconditioning: steam aging for 8 hours
Time = 5 seconds
MIL-STD-883E, Method 2003.7

• Lead Fatigue
Angle = 3°
Weight = 8oz.
Number of cycles = 5
MIL-STD-883E, Method 2004.5

Reliability Test Facilities
The Kuala Lumpur (Malaysia) test facility is equipped with:

• Automated testing

• Life test equipment-high and low temperature

• Temperature/humidity chambers

• High temperature ovens

• T/C equipment

In addition, the failure analysis lab facilities have the following capabilities:

• Electrical testing and verification

• Pin-to-pin measurements

• Package dissection and cross-sectioning

• Optical photomicroscopy

• Micromanipulators

• Real-time X-ray chamber

• Scanning electron microscope

• Access to external labs

Failure Analysis and Qualitative Reliability
When a reliability failure does occur, a detailed analysis is performed to provide data for corrective action, as well as guidelines for the design of future new products.

This on-going activity and the resulting feedback and action are illustrated in the accompanying diagram.

*Not all tests apply to all products.