Package & Thermal Management (45)

Application Note Packages Description - click on description below to view app note
AN-1025 SSOT packaging Maximum Power Enhancement Techniques for SuperSOT™-3 Power MOSFETs
AN-5026 BGA packaging Using BGA Packages
AN-5054 MLP packaging Low Noise Leadless Packages Advance Portable Designs
AN-9049 MLP packaging Assembly Guidelines for Fairchilds TinyBuck™ Packaging
AN-1029 SOIC packaging Maximum Power Enhancement Techniques for SO-8 Power MOSFETs
AN-5078 PQFN packaging Board Assembly Guideline for Fairchild High-Voltage Power88 Package
AN-4170 H-PSOF packaging Board Assembly Guideline for Fairchild TO-Leadless Package
AN-9747 UMLP packaging Assembly Guidelines for MicroFET™ 1.6x1.6mm Dual Packaging
AN-9040 MLP packaging Assembly Guidelines for Power33 Packaging
AN-9055 MLP packaging Assembly Guidelines for MicroFET™ 2x2 Dual Packaging
AN-9762 MLP packaging Fairchild Semiconductor Power33 Package Power MOSFET Solution in Multi-Cell Battery Protection Applications
AN-9057 MLP packaging Assembly Guidelines for Asymmetric Dual Power33 Packaging
AN-9746 UMLP packaging Assembly Guidelines for MicroFET™ 1.6x1.6mm Packaging
AN-4174 PQFN packaging AN-4174 Board Assembly Guideline for Fairchild Smart Power Stage 5 mm x 5 mm
AN-9048 MLP packaging Assembly Guidelines for Fairchilds 6x6 DriverMOS Packaging
AN-9037 MLP packaging Assembly Guidelines for 8x8 MLP DriverMOS Packaging
AN-9036 PQFN packaging Guidelines for Using Fairchilds Power56
AN-9046 PQFN packaging Assembly Guidelines for Dual Power56 Packaging
AN-1028 SOT223 packaging Maximum Power Enhancement Techniques for SOT-223 Power MOSFETs
AN-9045 CSP packaging WLCSP Assembly Guidelines
AN-9075 MODULE packaging Smart Power Module, Motion 1200 V SPM 2 Series User Guide
AN-9079 MODULE packaging SPM® 2 Series Thermal Performance by Mounting Torque
AN-9076 MODULE packaging New SPM® 2 Package Mounting Guidance
AN-9071 MODULE packaging Smart Power Module Motion SPM® in SPM45H Thermal Performance Information
AN-9070 MODULE packaging Smart Power Module Motion SPM® in SPM45H
AN-9072 MODULE packaging Smart Power Module Motion SPM&174; in SPM45H Mounting Guidance
AN-9097 MODULE packaging SPM® 55 Package Mounting Guidance
AN-9047 MLP packaging Assembly Guidelines for MicroFET-6 Packaging
AN-4167 MODULE packaging Mounting Guideline for F1 / F2 Modules with Press-Fit Pins
AN-5077 MODULE packaging Design Considerations for High Power Module (HPM)
AN-9082 MODULE packaging Motion SPM® 5 Series Thermal Performance Information by Contact Pressure
AN-9078 PQFN packaging Surface Mount Guidelines for Motion SPM 7 Series
AN-9077 PQFN packaging Motion SPM 7 Series User’s Guide
AN-5241 MLP packaging Guidelines for Pb-Free Soldering of Fairchild Components Based on JEDEC® J-STD 20D / IEC EN 61760-1:2006
AN-7001 BGA packaging Guidelines for Mounting Fairchilds BGA Packages
AN-1100 CSP packaging Thermal Considerations of Surface Mount Packages
AN-5075 CSP packaging Wafer-Level Chip-Scale Package (WLCSP) at Fairchild Semiconductor
AN-7528 ALS packaging (TB334) Guidelines for Soldering Surface Mount Components to PC Boards
AN-3011 BGA packaging Surface Mounting Technology Assembly Guidelines for Fairchilds Microcouplers™ (Ball Grid Array)
AN-5082 PQFN packaging Power56 Wave-Soldering Board Assembly Considerations
AN-7527 MLP packaging Dual Channel MicroFET™ 3x2 Power MOSFET Recommended Land Pattern and Thermal Performance
AN-5067 MLP packaging PCB Land Pattern Design and Surface Mount Guidelines for MLP Packages
AN-8029 UMLP packaging 28L, Dual-Row UMLP - Recommended Surface Mounting Procedures
AN-4166 TO126 packaging Heat Sink Mounting Guide
AN-6084 CSP packaging Suface Mount Asssembly Guideline for WLCSP 1.0 x 1.5