Our reliability programs focus on the areas of the reliability in the development of new technology, new processes, and new products, ensuring the changes to our product/process meet or exceed the design reliability, verification of on-going production reliability, and determining and correcting the cause of failure of any products that our customers experience.

Reliability Estimates

The FITs number for individual product is provided on the product Web page under the qualification support section.

FITS Calculation Information PDF

Process/Technology Reliability

Fairchild assesses process level reliability by providing quantifiable failure rates for various failure mechanisms, using specialized test structures and accelerated stress techniques. These stress techniques include traditional wearout testing as well as highly accelerated wafer-level reliability (WLR) testing. WLR tests provide supplementary data to the traditional stress techniques for the purposes of characterizing and improving process reliability during the development stage and monitoring reliability once the technology is in production.

Process Level Reliability Failure Mechanisms & Tests PDF
Reliability Failure Mechanism Acceleration Models PDF

Product Reliability

Emphasis on Technology Reliability in the advancement of New Product Introduction. Stress driven (JEDEC-47, AEC-Q100/Q101) and physics based (wafer level) test methods used to assess reliability during product qualification.

Qualification test methods are based on customer requirements, Fairchild Qualification specification, and current applicable industry standards.

Discrete Products Qualification Tests PDF

IC Products Qualification Tests PDF

Opto Products Qualifications Tests PDF

Reliability Stress Test Descriptions PDF

On-Going Reliability Monitoring

To ensure that qualified products continue to meet reliability targets, a monitor program tests generic device families on a periodic basis and provides information for the reliability test bank.

Reliability monitoring is preformed on both in house and subcontractor manufactured product and consists of JEDEC-47 or AEC-Q100/Q101 type stress level testing of product families and technologies.

Reliability Monitoring Tests PDF

Reliability Verification for Changes

Changes to products and processes that meet Fairchild's change notification requirements are fully tested to be compliant with the original product or process using the same or equivalent qualification tests originally used to qualify the product or process. These change qualification results are included in the change notification.

Change Notice Qualification PDF

Qualitative Reliability and Failure Analysis

Should a reliability failure occur with a Fairchild product, a detailed analysis is performed by Fairchild's failure analysis labs to determine the cause. The failure cause is used by the manufacturing site to determine the root cause of the failure and develop corrective action to prevent recurrence. The failure mechanism and root cause are updated in the design/process FMEA which are incorporated in the design of new products.

Requests for failure analysis can be made by submitting a request in myFairchild.

Qualitative Reliability and Failure Analysis