Fairchild's innovative TO-Leadless (TO-LL) advanced packaging for power semiconductors is designed for high-current applications.
TO-Leadless Packaging for Automotive
The TO-LL technology offers an extremely low package resistance, a very small footprint, and allows for exceptionally good EMI behavior. This technology is now offered in a range of voltage classes specifically designed and qualified for automotive applications.
- In combination with Fairchild's latest shielded gate trench PowerTrench™ MOSFET technology, the TO-LL package offers extremely low RDS(on) ranges as well as best-in-class switching and EMI performance.
Extremely Small Package
- The TO-LL package footprint is about 30 percent smaller compared to a D2PAK (TO263) package while it features up to 300 A current handling capabilities. Its height is almost half which is beneficial in many applications as space is usually tight.
Reduced Systems Cost
- The TO-LL package simplifies design and avoids additional passive components. Compared to other discrete packages, the number of parallel MOSFETs needed in high-current applications can be significantly reduced, making overall system costs lower.
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Typical Automotive High Power Applications
- Electric Power Steering
- Battery Switch
- High Current DC/DC
- Pump and Compressor Drive
- Starter Generator