TO-Leadless Advanced Packaging Technology

Fairchild's innovative TO-Leadless (TO-LL) advanced packaging for power semiconductors is designed for high-current applications.

TO-Leadless Packaging for Automotive

The TO-LL technology offers an extremely low package resistance, a very small footprint, and allows for exceptionally good EMI behavior. This technology is now offered in a range of voltage classes specifically designed and qualified for automotive applications.

Highest Efficiency

  • In combination with Fairchild's latest shielded gate trench PowerTrench™ MOSFET technology, the TO-LL package offers extremely low RDS(on) ranges as well as best-in-class switching and EMI performance.

Extremely Small Package

  • The TO-LL package footprint is about 30 percent smaller compared to a D2PAK (TO263) package while it features up to 300 A current handling capabilities. Its height is almost half which is beneficial in many applications as space is usually tight.

Reduced Systems Cost

  • The TO-LL package simplifies design and avoids additional passive components. Compared to other discrete packages, the number of parallel MOSFETs needed in high-current applications can be significantly reduced, making overall system costs lower.

Portfolio

Part
Number
Voltage
Rating
Max
RDS(ON)
Download
Datasheet
Order
Samples
FDBL9401_F08540 V0.65 mΩPDFSAMPLES
FDBL9403_F08540 V0.9 mΩPDFSAMPLES
FDBL9406_F08540 V1.2 mΩPDFSAMPLES
FDBL86210_F085150 V6.3 mΩPDFSAMPLES
FDBL86561_F08560 V1.1 mΩPDFSAMPLES
FDBL86361_F08580 V1.4 mΩPDFSAMPLES

See the full parametric table »

Packaging Information

H-PSOF 8L

Typical Automotive High Power Applications

  • Electric Power Steering
  • Battery Switch
  • High Current DC/DC
  • Pump and Compressor Drive
  • Starter Generator