Die & wafer

About Die & Wafer Process

Die and WaferIn addition to its broad portfolio of packaged semiconductors, Fairchild offers its customers the flexibility of using bare die for their designs. Carrier options include unsawn wafer, sawn wafer-on-film, and tape and reel.

For automotive applications, the Known Good Die (KGD) process combines high volume manufacturing and assembly processes with extensive testing and inspection to assure highest quality and reliability.

Fairchild can also create new die products for qualifying customers, including utilizing its existing package part portfolio. For information regarding product details or die availability, please contact a Fairchild sales representative or one of our authorized die distributors below.

Global

Semi Dice Bare Die Distribution
Semidice Headquarters
10961 Bloomfield Street
P.O. Box 3002
Los Alamitos
CA 90720
Tel 562 594 4631
Fax 562 430 5942
www.semidice.com

Micross Components
Micross Components
7725 N. Orange Blossom Trail
Orlando, FL 32810-2696
Tel 407-298-7100
Fax 407-290-0164
Email: sales.americas@micross.com

Micross Components
Micross Components
2 Hellesdon Park Road
Norwich
NR6 5DR
England
Tel +44 1603 788967
Fax +44 1603 788920
Email: baredie@micross.com

Require Die & Wafer product that is no longer supported in production? Contact our Authorized Obsolescence Distributor.


Micross Components
Rochester Electronics
16 Malcolm Hoyt Drive
Newburyport, Massachusetts 01950
Tel 978 462 9332
Fax 978 462 9512
Email: sales@rocelec.com
www.rocelec.com