High Power Modules

Fairchild's High Power Module (HPM) solutions offers higher reliability, efficiency, and power density to improve performance and reduce size and weight compared to a discrete implementation.

HPM modules provide additional system benefits including design-friendly layout, press-fit mounting terminals for fast solder-less assembly, and phase change material interface for optimal thermal conductivity.

Features and Benefits

  • High integration and compact design
  • Low stray inductances
  • Highest performance using Fairchild’s latest IGBT and diode technologies
  • Press-fit contact enabling solder-less assembly
  • Phase-change material interface adopted for optimal mounting to heatsink

Applications